Kulicke and Soffa Industries, Inc.

Thomas J Colosimo, Jr

Matthew B Wasserman

Adeel Ahmad Bajwa

Horst Clauberg

Michael P Schmidt-Lange

Jon W Brunner

Daniel P Buergi

Deepak Sood

Zhijie Wang

David A Rauth

Shu-Guo Tang

Edward T Laurent

Ivy Wei Qin

Guy Frick

John David Molnar

Horst Claubeg

A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bond head assembly for bonding a semiconductor element to a substrate at a bonding area of the bonding system; a reducing gas delivery system for providing a reducing gas to the bonding area during bonding of the semiconductor element to the substrate; and a gas composition analyzer configured for continuously monitoring a composition of the reducing gas during operation of the bonding system.

Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methods

A method of monitoring gas byproducts of a bonding system is provided. The method includes: providing a plurality of bonding systems, each of the bonding systems including a reducing gas delivery system for use in connection with a bonding operation, each of the bonding systems being configured for exhausting gas byproducts; connecting each of the bonding systems to a monitoring device using a respective gas delivery path; and monitoring a composition of at least a portion of the gas byproducts with the monitoring device.

Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems

A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.

Bonding systems, and methods of providing a reducing gas on a bonding system

A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Methods of bonding of semiconductor elements to substrates, and related bonding systems

A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Systems and methods for measuring physical characteristics of semiconductor device elements using structured light

A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

Fluxing systems, bonding machines including fluxing systems, and methods of operating the same

A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

Methods of forming wire interconnect structures

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

Growing community of inventors

West Chester, PA, United States of America

Thomas J Colosimo, Jr