International Business Machines Corporation

Globalfoundries Inc.

Sintef

Technische Universitaet Chemnitz

Ncc Nano, LLC

Intrinsiq Materials Limited

Thomas J Brunschwiler

Bruno Michel

Gerd Schlottig

Stephan Paredes

Evan G Colgan

Stefano Sergio Oggioni

Kerry Bernstein

Hugo Eric Rothuizen

Harry S Barowski

Andreas Huber

Hubert Harrer

Tim Niggemeier

Jochen Supper

Ryan Joesph Linderman

Urs Kloter

Chin Lee Ong

Javier V Goicochea

Jonas R Weiss

Ingmar G Meijer

Ryan Joseph Linderman

Michael J Ellsworth, Jr

Timothy Joseph Chainer

Mark Delorman Schultz

Pritish Ranjan Parida

Roger F Dangel

Erich M Ruetsche

Norbert M Meier

Arvind Raj Mahankali Sridhar

Jonas Zuercher

Joel Abraham Silberman

Walter Heinrich Riess

Heiko Wolf

Luca Del Carro

John Ulrich Knickerbocker

Martin L Schmatz

Michel Despont

Peter Vettiger

Cornelia K Tsang

Patrick Ruch

Patricia Maria Sagmeister

Andreas Christian Doering

Sebastian Gerke

Bruno Michael

Mark Alfred Lantz

Charles Leon Arvin

Keiji Matsumoto

Jeffrey Allen Zitz

Siegfried Friedrich Karg

Jens Hofrichter

Ronald Peter Luijten

Werner Escher

Richard J Dixon

Cyrill Kuemin

Reto Waelchli

Dominic Gschwend

Timo J Tick

Joerg-Eric Sagmeister

Maaike M Visser Taklo

Bernhard Wunderle

Kerry Yu

Michael A Gaynes

Paul Stephen Andry

Eren Kursun

Bucknell Chapman Webb

Jeffrey Donald Gelorme

Thomas Weiss

Bert Jan Offrein

Eric D Perfecto

Gerard McVicker

John Harold Magerlein

Ronald Pete Luijten

Kenneth Charles Marston

Andrea Giovannini

Antonio La Porta

Gary William Maier

Rachel Gordin

Marcus E Interrante

Chris Muzzy

Patrick Lustenberger

Kevin Drummond

Jens Oliver Ammann

Michele Castriotta

Stephanie Allard

Ozgur Ozsun

Adam Ivankay

Martin Witzig

Hugo E Rothuizen

Mark A Lantz

Suiying Ye

Reio Waelchli

Jonas Zürcher

Stephen Paredes

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, a system board configured to be electrically connected to the casing, and upper and lower cards connected to the casing for electrically connecting the casing to the system board.

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

A computer-implemented method for classification of data by a machine learning system using a logic constraint for reducing a data labeling requirement. The computer-implemented method includes: generating a first embedding space from a first partially labeled training data set, wherein in the first embedding space, content-wise related training data of the first partially labeled training data are clustered together, determining at least two clusters in the first embedding space formed from the first partially labeled training data, and training a machine learning model based, at least in part, on a second partially labeled training data set and the at least two clusters, wherein the at least two clusters are used as training constraints.

Semi-supervised learning with group constraints

Manufacturing of flip-chip type assemblies is provided, and includes forming one or more contact elements of electrically conductive material on a carrier surface of at least one chip carrier, providing a restrain structure around the contact elements, depositing solder material on the contact elements and/or on one or more terminals of electrically conductive material on a chip surface of at least one integrated circuit chip, and placing the chip with each terminal facing corresponding contact elements. Further, the method includes soldering each terminal to the corresponding contact element by a soldering material, the soldering material being restrained during a soldering of the terminals to the contact elements by the restrain structure, and forming one or more heat dissipation elements of thermally conductive material on the carrier surface for facing the chip surface displaced from the terminals, where the one or more heat dissipation elements are free of any solder mask.

Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask

Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.

Personalized copper block for selective solder removal

An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste

A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

Particle-based, anisotropic composite materials for magnetic cores

The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.

Printed circuit board with edge soldering for high-density packages and assemblies

Adsorption heat exchanger devices () are provided for use in solid sorption refrigeration systems () together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules () of the adsorbent material whereby localized bonds () are formed around the contact points on curing of the binder.

Adsorption heat exchanger devices

A solution relating to electronic devices of flip-chip type is provided, which includes at least one chip carrier having a carrier surface, the carrier(s) including one or more contact elements of electrically conductive material on the carrier surface, at least one integrated circuit chip having a chip surface, the chip(s) including one or more terminals of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material soldering each terminal to the corresponding contact element, and a restrain structure around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements. The carrier includes one or more heat dissipation elements of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.

Flip-chip electronic device with carrier having heat dissipation elements free of solder mask

A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Method for electrical coupling and electric coupling arrangement

The present invention is directed to a method for interconnecting two components. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels, extending in-plane with an average plane of the pad, so as to form at least two raised structures. The second interconnect component includes a second substrate and a set of metal pillars arranged on a main surface. The structured metal pads are bonded to a respective, opposite one of the metal pillars, using metal paste. The paste is sintered to form porous metal joints at the level of the channels. Metal interconnects are obtained between the substrates. During the bonding, the metal paste is sintered by exposing the structured metal pads and metal pillars to a reducing agent. The channels and raised structures improve the penetration of the reducing agent.

Chip packages with sintered interconnects formed out of pads

A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-&#xe0;-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Disconnect assembly for active cooling of packaged electronics

A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Counter-flow expanding channels for enhanced two-phase heat removal

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in the casing, and for forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing. Opposing edges of the upper card are located between vertical planes defined by the outer sidewalls of the upper portion of the casing.

Growing community of inventors

Rueschlikon, Switzerland

Thomas J Brunschwiler