Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Thomas J Augustin

Stephan Karl Barsun

Christopher Gregory Malone

Jeremy Ian Wilson

Steven R Hahn

Stephen Daniel Cromwell

Todd D Robertus

Christopher G Malon

A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the package lid and at a second attachment point to the circuit board. Isolation material is provided at the attachment point of the support frame to the substrate or package lid, or at the second attachment point of the support frame to the circuit board.

Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation

Disclosed is land grid array (LGA) assembly using a compressive load. An LGA assembly includes a first component located on the top of the LGA assembly; a center load screw coupled to the first component; and a second component, wherein the center load screw is received on the second component upon turning the center load screw in a first direction. Further turning of the center load screw in the first direction after the center load screw is received on the second component, operates the first component to apply a compressive load within the LGA assembly.

Land grid array assembly using a compressive liquid

A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.

Circuit board support assembly

An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.

Method and apparatus for shock and vibration isolation of a circuit component

A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.

An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf springs in contact with the top plate, a leaf spring cradle that carries the leaf springs, with the cradle including upper projections that project through corresponding slots in the top plate, a pin inserted through openings in the upper projections, and a linear slide cam located on an upper surface of the top plate between the upper projections and further located below the pin. The cam operates in a first position to transfer a load the replaceable component to securely hold the replaceable component to the integrated circuit and a second position to allow placement of the replaceable component on the integrated circuit.

Leaf spring load plate with retained linear cam slide

Disclosed herein are electromagnetic interference 'EMI' containment devices and methods for abating interference generated by electronic devices.

EMI containment device and method

A circuit board programming/debugging arrangement and method includes a circuit board and frame assembly and a programming/debugging device. The assembly includes a printed circuit board, a first frame section coupled to the circuit board and at least one second frame section coupled to at least one of the circuit board and the first frame section. The second frame section is movable from an operational position to a non-interfering programming/debugging position wherein the second section would interfere with coupling of the programming/debugging device to the circuit board. The programming/debugging device is coupled to the circuit board while the at least one second frame section is in the programming/debugging position.

Circuit board and frame assembly

A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.

Support for varying sizes of memory cards for shock and vibration

A fluid-flow balancer mimics the air-flow resistance of a component omitted from an electronic system so that omission causes little or no disruption to or alteration of the flow of a cooling fluid. This prevents overheating that such disruption or alteration may otherwise cause. In addition, the fluid-flow balancer may also mimic the EMI suppression characteristics of the omitted component. Thus, a system not fully populated with components can still be adequately cooled and shielded without changing the cooling or shielding systems.

Fluid-flow balancer, electronic system and related methods

A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.

Heat dissipation device retention assembly

A method and apparatus to provide air-flow balancing with a card guide frame. One embodiment of the invention involves a method to assemble an air-flow balancing card guide frame and one or more substrates. A second embodiment of the invention involves a method to design an air-flow balancing card guide frame. A third embodiment of the invention involves an assembled air-flow balancing card guide frame and one or more substrates.

Growing community of inventors

El Dorado Hills, CA, United States of America

Thomas J Augustin