Gould Electronics Inc.

Ga-tek, Inc.

Other

Gould Inc.

Nikko Materials Usa, Inc.

Thomas J Ameen

Peter Peckham

Adam G Bay

Robert D DeWitt

Ronald K Haines

Edward Czapor

Stacy A Riley

Chin-Ho Lee

John P Callahan

Albert E Nagy

Barbara J Kidon

John A Payak

Jerome M Cangelosi

Gregory L Orloff

A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR&reg; sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0&deg; F. and 200&deg; F.

Method of making a copper on INVAR&reg; composite

This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 &angst; to about 80 &angst;; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.

Treated copper foil and process for making treated copper foil

An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.

Electroforming cell

An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Method and apparatus for sequentially metalizing polymeric films and products made thereby

This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 .ANG. to about 80 .ANG.; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.

In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a metal foil oxidizer solution containing water and at least about 7 ppm dissolved oxygen, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a silane solution containing from about 0.1 to about 10% v/v of a silane compound.

Adhesion enhancement for metal foil

Method and apparatus for sequentially metalizing polymeric films and

In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a first solution containing a metal foil oxidizer and less than about 5 g/l of a hydroxide compound, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a second solution containing from about 0.1 to about 10% v/v of a silane compound, with the proviso that the metal foil is not contacted with a reducing agent after contact with the first solution.

The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.

Non-cyanide brass plating bath and a method of making metallic foil

Method and apparatus for sequentially metalized polymeric films and

Method for forming printed circuits

The present invention relates to methods of etching polyimide from a substrate and to the etched substrates prepared according to such methods. In one embodiment, the present invention provides a method of etching polyimide from a substrate, comprising the steps of: providing a basic bath; ultrasonically agitating said basic bath; exposing said substrate containing polyimide to said basic bath; rinsing said substrate with hot water; optionally repeating the aforementioned steps at least once; and recovering an etched substrate. In another embodiment, the present invention provides a method of etching polyimide from a substrate, comprising the steps of: providing a basic bath; exposing said substrate containing polyimide to said basic bath; rinsing said substrate with hot water; maintaining the high loading capacity of said basic bath after exposure of polyimide to said basic bath, comprising cooling at least a portion of said basic bath thereby precipitating particles and separating the particles from said basic bath prior to reuse of said basic bath; and recovering an etched substrate.

Method of etching polyimide

An easily peelable or chemically strippable laminate and method of making same comprising an aluminum carrier, an aluminum oxide layer, which is at least 800 Angstroms thick and deposited on the aluminum carrier, copper foil electrodeposited on the aluminum oxide layer and optionally, a brass layer electrodeposited on the copper foil have been discovered. Such laminates find utility in the electronics industry in the fabrication of printed circuit boards and afford an ease of strippability of the protective aluminum carrier-aluminum oxide layer heretofore unknown in the industry. The protective aluminum carrier-aluminum oxide layer of the laminates of the present invention may also be chemically etched away providing a universal carrier for copper foil.

Universal carrier supported thin copper line

An apparatus for applying a surface treatment to a metal foil comprising a drum rotatable about a generally horizontal axis for guiding a continuous metal foil about a predetermined path;

Growing community of inventors

Mentor, OH, United States of America

Thomas J Ameen