Intel Corporation

Thomas I Sounart

Aleksandar Aleksov

Kristof Darmawikarta

Suddhasattwa Nad

Darko Grujicic

Sashi S Kandanur

Rengarajan Shanmugam

Marcel A Wall

Helme Castro De La Torre

Glass substrates having transverse capacitors for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a glass substrate having a through glass via between a first surface and a second surface opposite the first surface. A transverse capacitor is located in the through glass via. The transverse capacitor includes a dielectric material positioned in a first portion of the through glass via, a first barrier/seed layer positioned in a second portion of the through glass via, and a first conductive material positioned in a third portion of the through glass via.

Glass substrates having transverse capacitors for use with semiconductor packages and related methods

Growing community of inventors

Chandler, AZ, United States of America

Thomas I Sounart