Atotech Deutschland Gmbh

Thomas Hülsmann

Heiko Brunner

Josef Gaida

Dirk Tews

Christian Sparing

Norbert Lützow

Gabriela Schmidt

Fabian Michalik

Arno Clicque

Bernd Froese

Neal Wood

Mirko Kloppisch

Tatjana Cukic

Andry Liong

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each Ris a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Etching solution for copper and copper alloy surfaces

Growing community of inventors

Berlin, Germany

Thomas Hülsmann