Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Thomas Höfer

Herbert Brunner

Günter Waitl

Georg Bogner

Uwe Strauss

Bert Braune

Gertrud Kräuter

Martin Haushalter

Harald Jäger

Markus Zeiler

Frank Möllmer

Rainer Sewald

Karsten Auen

Tilman Eckert

Werner Kuhlmann

Matthias Winter

Markus Arzberger

Michael Schwind

Raimund Schwarz

Mario Wiengarten

Harald JÄGER

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

Optoelectronic light-emitting component and leadframe assemblage

A laser diode device including a housing having a mounting area in a cavity of the housing, at least one laser diode chip that emits electromagnetic radiation through a radiation exit area during operation, at least one covering element which is transmissive, at least in places, to the electromagnetic radiation generated by the laser diode chip during operation, and a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element, wherein the radiation exit area of the laser diode chip runs substantially transversely or substantially perpendicularly with respect to the mounting area and/or with respect to the covering element, the covering element connects to the housing, and the covering element tightly closes the housing.

Laser diode devices

An optoelectronic component () is proposed that comprises a housing body () and at least one semiconductor chip () disposed thereon, said housing body having a base part () comprising a connector body (), on which a connecting conductor material () is disposed, and said housing body having a reflector part () comprising a reflector body (), on which a reflector material () is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

Optoelectronic component with multi-part housing body

A detector system with a microelectronic semiconductor chip and a separate optoelectronic detector chip is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.

Detector system and detector subassembly

A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

An optoelectronic device, comprising a package body () and at least one semiconductor chip () arranged on the package body (). The surface of the package body () has a metallized subregion () and a non-metallized subregion (). The package body () includes at least two different plastics (), one of the plastics being non-metallizable () and this plastic determining the non-metallized subregion (). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

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Lappersdorf, Germany

Thomas Höfer