Infineon Technologies Ag

Siemens Aktiengesellschaft

Thomas Huber

Manfred Pröll

Stephan Schröder

Manfred Moser

Frank Adler

Martin Versen

Matthias Schreiter

Manfred Dobler

Christian Stocken

Georg Erhard Eggers

Dana Pitzer

Martin Nirschl

Jürgen Auge

Peggy Menck

A device for detecting at least one substance of a fluid, has a piezoacoustic thin film resonator with a piezoelectric layer on which electrode layers are arranged, and an adsorption surface for adsorbing the fluid substance, wherein the piezoelectric and electrode layers and the adsorption surface are designed and arranged on each other such that by electrically activating the electrode layers, an excitation alternating field can be coupled into the piezoelectric layer. The thin film resonator can be excited to a resonance oscillation frequency fwhich depends on an amount of the substance adsorbed on the adsorption surface because of an excitation alternating field coupled into the piezoelectric layer. An electrical insulating layer is arranged directly on a side of one of the electrode layers facing away from the piezoelectric layer. Particularly advantageous is the combination of an aluminum electrode layer and a silicon dioxide insulating layer.

Device and method for detecting a substance using a thin film resonator (FBAR) having an insulating layer

In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip () comprises at least one contact () to be soldered or is electrically conductively connected to at least one contact () to be soldered that is situated outside the semiconductor chip. The semiconductor chip () furthermore comprises a temperature sensor device (), which determines a measurement quantity corresponding to the temperature. A processing device () has an analog-to-digital converter (), which is electrically conductively connected to the temperature sensor device () and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (), which is electrically conductively connected to the temperature sensor device () and the processing device (), supplies these components with an operating voltage. A data memory () serves for storing the at least one storable signal. An electrical line () connected to the data memory () serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.

Arrangement for determining a temperature loading of an integrated circuit and method

The invention involves a process for heating a semi-conductor component, as well as a semi-conductor component, whereby a device for heating the semi-conductor component is provided on the semi-conductor component.

Semiconductor component with internal heating

A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

Device for cooling memory modules

Two methods check functional capability of electrical connections between address lines of a printed circuit board of a memory module and address line contacts of an integrated semiconductor memory chip mounted on the printed circuit board. Ruptured solder contacts are conventionally examined optically or investigated by electrical resistance measurements; however, the latter do not work in the case of memory modules with a number of semiconductor chips, the pin contacts of which are connected in parallel by the address lines. The methods make it possible to locate interrupted contacts on individual address lines by the indirect use of a write-read access to the semiconductor memory chip, specifically utilizing the misrouting of writing and reading commands produced by defective contact connections.

Method of checking electrical connections between a memory module and a semiconductor memory chip

An adapter apparatus for receiving memory modules, each of which has a plurality of data terminals and a plurality of control terminals, comprises first data terminals, first control terminals, a first socket for receiving a first memory module with second data terminals and second control terminals, wherein the second data terminals are associated to the data terminals of the first memory module, wherein the second control terminals are associated to the control terminals of the first memory module, a second socket for receiving a second memory module with third data terminals and third control terminals, wherein the third data terminals are associated to the data terminals of the second memory module, wherein the third control terminals are associated to the control terminals of the second memory module, a signal transformation circuit with an input and an output, wherein the input is connected to the first control terminals, and wherein the output is connected to the second control terminals and to the third control terminals, and wherein a second group of first data terminals is connected to the third data terminals.

Adapter apparatus for memory modules

Signal transit times on printed circuit boards which are equipped with all the passive components but without any active components can be determined using automatic standard test equipment composed of a standard test unit and a performance board with fittings attached thereto. In that first, using a standard routine of the test unit, a transit time is measured on the performance board from the CIF connector as far as the fitting, then a printed circuit board is plugged into the fitting location determined for it and then the sum transit time of the CIF connector is measured as far as the landing pad on the printed circuit board. By forming differences between the two measured values, the transit times on a printed circuit board can be measured with a high degree of precision with the automatic standard test equipment used in standard module testing technology.

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Munich, Germany

Thomas Huber