General Electric Company

Thomas Halvorsrod

Bruno Hans Haider

Kjell Kristoffersen

Robert Gideon Wodnicki

Rayette Ann Fisher

Shinichi Amemiya

Naresh Kesavan Rao

Krishnakumar Sundaresan

A transmission circuit for use with an ultrasonic probe including an ultrasonic transducer is provided. The transmission circuit includes a high voltage current DAC configured to output a drive current of an ultrasonic transducer to transmit and receive ultrasound, and a waveform generator configured to output a control signal from the high voltage current DAC to the high voltage current DAC with a predetermined timing. The control signal configured to output the drive current with a desired magnitude.

Transmission circuit, ultrasonic probe and ultrasonic image display apparatus

An ultrasound imaging system (). An exemplary system () includes a plurality of transducer elements () formed in subarrays () and a plurality of subarray circuit units (), with each circuit unit () connected to a subarray () of the transducer elements (). The circuitry in each unit () comprises a plurality of integrated circuits (), with at least a first () of the integrated circuits formed over a second () of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit () includes a first plurality of first bond pads () along a surface () thereof and the second integrated circuit () includes a second plurality of second bond pads () along a surface () thereof, with bond wires () extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Ultrasound imaging system

An ultrasound imaging system (). An exemplary system () includes a plurality of transducer elements () formed in subarrays () and a plurality of subarray circuit units ('), with each circuit unit (&#x2032;) connected to a subarray () of the transducer elements (). The circuitry in each unit (&#x2032;) comprises a plurality of integrated circuits (), with at least a first () of the integrated circuits formed over a second () of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit () includes a first plurality of first bond pads () along a surface () thereof and the second integrated circuit () includes a second plurality of second bond pads () along a surface () thereof, with bond wires () extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Systems and methods for adjusting gain are described. The systems includes a probe. The probe includes a housing, a transducer element configured to receive a signal, and an adjustable gain amplifier located inside the housing and configured to adjust a gain provided to the signal based on a function having a slope other than zero.

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Vestfold, Norway

Thomas Halvorsrod