Raytheon Company

Thomas H Taylor

Matthew D Brown

James Stephen Mason

Timothy C Fletcher

James S Wilson

Karl L Worthen

George F Barson

Waid A Paine

Joshua Lamb

William P Hull, Jr

Steven P McFarlane

Lucian A Brasier

James E Lewis

Lauren M Garcia

A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Multi-band electronically scanned array antenna

The present invention relates to radio frequency and microwave connectors, and more particularly to grounding methods for printed wiring board edge-launch connectors. The grounding method comprises conducting tabs secured to a PWB and to an attached connector frame holding coaxial connectors. The conducting tabs thus provide a ground connection between the connector frame and one or more ground conductors on the PWB.

Method for RF connector grounding

According to an embodiment of the present invention, a subassembly for a phased array radar includes a substrate generally lying in a first plane, the substrate including a plurality of transmit/receive modules coupled to a mounting surface and a plurality of radiating elements formed adjacent the mounting surface, and a multi-function board generally lying in a second plane parallel to the first plane. The multi-function board is in spaced apart relation to the substrate and may include RF manifolding and logic/power distribution functions for the transmit/receive modules.

Subassembly for an active electronically scanned array

According to an embodiment of the present invention, a multi-function carrier structure for a phased array radar includes a substrate that includes a mounting surface for a plurality of transmit/receive modules, a plurality of radiating elements integrally formed in the substrate adjacent the mounting surface, and a plurality of cooling channels integrally formed within a thickness of the substrate. The substrate is formed from a material having a coefficient of thermal expansion similar to respective substrates of the transmit/receive modules.

Integrated subarray structure

According to an embodiment of the present invention, a transmit/receive module for a phased array radar includes a substrate, a ground plane formed outwardly from the substrate, and one or more dielectric layers formed outwardly from the ground plane. The one or more dielectric layers have RF and DC routing formed therein. The transmit/receive module further includes an electronic device coupled outwardly from the one or more dielectric layers, and a lid coupled to a portion of the one or more dielectric layers.

Transmit/receive module and method of forming same

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Wylie, TX, United States of America

Thomas H Taylor