Semitool, Inc.

Applied Materials, Inc.

Other

Thomas H Oberlitner

Daniel J Woodruff

Kyle Moran Hanson

John M Pedersen

LinLin Chen

Vladimir Zila

Timothy J Reardon

Craig P Meuchel

James J Erickson

Eric J Bergman

Aleksander Owczarz

Raymon F Thompson

Randy Harris

Richard W Plavidal

Steve L Eudy

Daniel L Durado

Wayne J Schmidt

Matthew C Egloff

Cameron H Law

Paul R McHugh

Marvin L Bernt

Brian Aegerter

Adam Marc McClure

Bridger Earl Hoerner

Andrew Anten

Douglas W Carr

Justin Boucher

Cameron Law

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Plating systems having reduced air entrainment

Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.

Systems and methods for wetting substrates

A processing system for electroplating semiconductor wafers and similar substrates includes an electrolyte tank, at least one processing chamber connected to the electrolyte tank via fluid lines, and an electrolyte analyzer. The electrolyte analyzer may have a probe, such as a voltammetry probe, in the electrolyte tank, a pump, a reservoir and at least one valve, with these components connected via fluid lines to form a fluid loop. The valve may be switchable to provide a closed fluid loop where electrolyte circulates through the probe to analyze the electrolyte, and to provide an open fluid loop to removal of the used electrolyte and introduction of fresh electrolyte from the tank into the fluid loop. The used electrolyte may be moved to a facility drain and not returned to the electrolyte tank, to reduce risk of contamination.

Closed loop electrolyte analyzer

Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly. The cleaning electrode may be disposed along a position of the motion path that is beyond the range of motion required to process the microelectronic workpiece so that the programmable controller may be programmed to conduct a cleaning cycle while a microelectronic workpiece is present in the reactor for processing.

Processing apparatus including a reactor for electrochemically etching microelectronic workpiece

An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece

End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.

End-effectors for handling microelectronic workpieces

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

Semiconductor processing apparatus

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Methods and apparatus for processing the surface of a microelectronic workpiece

Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

Apparatus for processing the surface of a microelectronic workpiece

An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with one aspect of the invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further aspect of the invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

Semiconductor processing spray coating apparatus

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Kalispell, MT, United States of America

Thomas H Oberlitner