Freescale Semiconductor,inc.

Motorola Corporation

Nxp Usa, Inc.

Thomas H Koschmieder

Terry E Burnette

Varughese Mathew

Sheila F Chopin

Andrew J Mawer

A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

Triode with wirebonded structure and method of making

The present disclosure provides for embodiments of packaged semiconductor devices. In one embodiment, a packaged semiconductor device for a die includes an exposed structure. The die has an active surface and a backside surface opposite the active surface. A first surface of the exposed structure is joined to die attach material, and the die attach material is further joined to the backside surface of the die. The exposed structure includes a plurality of openings through the exposed structure within a perimeter of the die, and the die is exposed through the plurality of openings.

Semiconductor device attached to an exposed pad

A device includes an integrated circuit (IC) carrier for a semiconductor device, and a coating on the IC carrier. In the presence of an electrical field or a magnetic field, the coating includes a first functional group that attracts anions and a second functional group that attracts cations.

Integrated circuit carrier coating

An apparatus and method uses a die having at least one perimeter side with multiple pads. A structure is positioned between the at least one perimeter side and the multiple pads having multiple layers within the die. The structure functions as both a strain gauge and a crack stop. The structure arrests cracks from propagating from the at least one perimeter side to an interior of the die and provides an electrical resistance value as a function of an amount of strain existing where the structure is positioned. In another form the structure is implemented on a substrate such as a printed circuit board rather than in a semiconductor die.

Multiple layer strain gauge

A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.

Lead solder indicator and method

Improved electro-mechanical connections between a packaged semiconductor die () and a printed circuit board () with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate () having a surface with angulated portions. Electrically conductive surfaces () are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface () over a non-planar or angulated package substrate (). The electrically conductive angulated surfaces improve reliability of solder joints () upon connecting the packaged semiconductor die to the printed circuit board (). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.

Semiconductor package having angulated interconnect surfaces

A semiconductor device ( ) includes a semiconductor die ( ) having electronic circuitry that is connected to a substrate ( ). The substrate ( ) is used to interface the semiconductor die ( ) to a printed circuit board ( ). The substrate ( ) includes a plurality of bonding pads ( ). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads ( ) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads ( ). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.

Growing community of inventors

Austin, TX, United States of America

Thomas H Koschmieder