Abb Schweiz Ag

Hitachi Energy Ltd

Hitachi Energy Switzerland Ag

Audi Ag

Abb Research Ltd.

Abb Technology Ag

Abb S.p.a.

Abb E-mobility B.v.

Abb Technology Ltd

Abb Power Grids Switzerland Ag

Thomas Gradinger

Uwe Drofenik

Daniele Torresin

Tor Laneryd

Francesco Agostini

Heinz Lendenmann

Thomas Wagner

Bruno Agostini

Francisco Canales

Mathieu Habert

Fabian Mohn

Didier Cottet

Juergen Schuderer

Felix Greuter

Andreas Apelsmeier

Federico Gamba

Rafael Murillo

Timo Koivuluoma

Lise Donzel

Slavo Kicin

Oscar Apeldoorn

Patrik Reto Kaufmann

Esa Virtanen

Rudi Velthuis

Benjamin Söhnle

Jürgen Schuderer

Felix Traub

Berk Yesin

Chunlei Liu

Santanu Singha

Milad Maleki

Francoise Molitor

Daniel Kearney

Ki-Bum Park

Bernhard Wunsch

Andreas Vögeli

Gernot Riedel

Kim Missing

Niko Pavlicek

Tilo Buehler

Mika Norolampi

Marcel Merk

Hui Huang

Adrian Zuckerberger

Matteo Fabbri

Gabriel Ortiz

Gabriel Ignacio Ortiz

Chunlei Lui

Oddvar Herland

Raphael Cagienard

Jean-Yves Loisy

Fabio Bolgiani

David Baumann

Antonio Nogues

Lorena Cebrian

Carlos Roy

A transformer includes a first winding arranged around an axis, and a second winding arranged around the axis. The second winding includes a litz wire having an end portion located at an axial end position of the second winding and a middle portion located at an axial middle position of the second winding. The litz wire has a first cross section at the end portion and a second cross section at the middle portion, the cross sections each including in a quadrant between the axial outward direction and the direction pointing towards the first winding a curvature extending between the axial outward direction and the direction pointing towards the first winding. The curvature of the first cross section is smaller than the curvature of the second cross section thereby reducing the peak magnitude of the electrical field between the end portion of the second winding and the first winding.

Transformer and method of manufacturing a transformer

An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

Arrangement comprising a baseplate for a power semiconductor module and a cooler

A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Direct cooling of a power converter by using a stamped plate

A power electronic converter includes a plurality of converter cells, each comprising an inductive power transfer stage having a coupled inductor coupling first and second sides of the converter cell, wherein the inductor comprises a first winding around a first magnetic core and a second winding around a second magnetic core; wherein the first winding and the first magnetic core are separated from the second winding and the second magnetic core by a flat electric insulation layer that provides electric insulation between the first and second sides of the converter cell; wherein at least two of the coupled inductors are arranged so that their insulation layers form a single contiguous insulation layer.

Inductive fast charger

A DC/DC converter which includes a first DC link, the first DC link can be a first DC link capacitor; a first plurality of N>1 converter bridges connected in parallel to the first DC link; and a transformer, the transformer can be a medium frequency transformer. The transformer includes a primary side and a secondary side, the primary side including at least one primary winding. The converter further includes a first plurality of N impedance elements, for each converter bridge, a respective impedance element of the first plurality of impedance elements is connected between the converter bridge and the at least one primary winding.

Current balancing in power semiconductors of a DC/DC converter

A transformer is described. The transformer includes a transformer core having a core leg having a longitudinal axis, a low voltage winding arranged around the core leg, the low voltage winding extending along a first length in the direction of the longitudinal axis, a high voltage winding arranged around the low voltage winding, the high voltage winding extending along a second length in the direction of the longitudinal axis, wherein the second length is shorter than the first length, and a casting embedding the low voltage winding and the high voltage winding. The casting has a recess. The recess is provided at a radial location of the high voltage winding and the recess extends in the direction of the longitudinal axis.

Transformer with a casting embedding a winding arrangement and method of manufacturing a winding arrangement for a transformer

A resonant DC/DC converter which has a first DC link, preferably including a first DC link capacitor; a DC/AC converter which has a first plurality of N>1 converter bridges connected in parallel to the first DC link; each converter bridge comprising a plurality of switches each of which may be switched between a conducting state and a non-conducting state. The resonant DC/DC converter also includes an AC intermediate circuit having an input connected to an output of the DC/AC converter and comprising: a transformer, preferably a medium frequency transformer, having a primary side and a secondary side; the primary side comprising at least one primary winding; a first plurality of N capacitors, wherein for each converter bridge, a different one from the first plurality of capacitors is connected between said converter bridge and the at least one primary winding.

Redundancy of a resonant converter stage by frequency adaptation

An electrical component includes a ferromagnetic core with a first and a second leg; a primary winding with a first primary winding portion arranged around the first leg of the ferromagnetic core and a second primary winding portion arranged around the second leg of the ferromagnetic core; wherein the first primary winding portion and the second primary winding portion each include parallel connectable conductors arranged around the ferromagnetic core in a cross section with the conductors being radially displaced with respect to each other at radial row positions, wherein the number of conductors of the first primary winding portion is equal the number of conductors of the second primary winding portion.

Electrical component, especially transformer or inductor

In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

Arrangement of a power semiconductor module and a cooler

A transformer includes a transformer core having a first core leg having a first longitudinal axis and second core leg having a second longitudinal axis; a first low voltage (LV) winding arranged around the first core leg, a first high voltage (HV) winding arranged around the first LV winding; a second low voltage (LV) winding arranged around the second core leg; and a second high voltage winding arranged around the second LV winding, wherein the first HV winding is provided with a first HV connector and a second HV connector each extending substantially perpendicular away from the first longitudinal axis, and wherein the second HV winding is provided with a third HV connector and a fourth HV connector each extending substantially perpendicular away from the second longitudinal axis.

Medium frequency transformer

An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

Electric power converter device with improved integration of cooler frame

A dual active bridge DC/DC converter in accordance with the invention comprises a first DC link, preferably comprising a first DC link capacitor; a converter bridge connected to the first DC link; a transformer, preferably a medium frequency transformer, having a primary side and a secondary side; the primary side of the transformer comprising a plurality of M>1 primary windings, each of the plurality of primary windings having a first and a second terminal; wherein the dual active bridge DC/DC converter further comprises a first plurality of M energy transfer inductors; and wherein for each of the M primary windings, a different one from the first plurality of energy transfer inductors is connected between said primary winding bridge and the converter bridge.

Dual active bridge converter cell with split energy transfer inductor for optimized current balancing in the medium frequency transformer (MFT)

A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

Semiconductor component, motor vehicle, and method for producing a semiconductor component

A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Subsea power module

One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

Power semiconductor module and method of forming the same

Growing community of inventors

Aarau Rohr, Switzerland

Thomas Gradinger