Schweizer Electronic Ag

Continental Automotive Gmbh

Thomas Gottwald

Christian Rössle

Alexander Neumann

Christian Roessle

Gerald Hauer

Tobias Steckermeier

Roland Brey

Ulrich Ockenfuss

Bernd Reisslöhner

Rainer Jäackle

Thomas Rall

Christian Dold

Dirk Gennermann

Printed circuit board module () having a printed circuit board () and a heatsink (), and, provided between the printed circuit board () and the heatsink (), a two-dimensional heat-conducting element () comprising a ceramic carrier () coated with a phase change material (). In the printed circuit board () or the heatsink (), a through-bore () may be provided to accommodate a screw () and one end of the screw () may mesh into a receiving hole () which preferably has a mating thread and is formed in the heatsink () or the printed circuit board (), wherein a screw head () of the screw () especially has a sprung washer element () beneath it.

Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer

A power-electronic metal-ceramic module () comprising a metal-ceramic substrate () made of a ceramic carrier () having a metal top and bottom ply (), which is joined on or in the metal top ply () and/or the metal bottom ply () with a metal layer () forming a frame () for accommodating at least one electronic component () and at least one electronic component () accommodated in the frame ().

Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making

A method for contacting a metallic contact pad embedded in a printed circuit board layer sequence, comprising the steps of producing a first hole matrix having a plurality of holes in a surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, of applying a metal layer in order to at least partly fill the holes of the first hole matrix, of producing a second hole matrix having a plurality of holes in the surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, wherein the holes of the second hole matrix are arranged in a manner offset relative to the holes of the first hole matrix, and of applying a metal layer in order to at least partly fill the holes of the second hole matrix, and a correspondingly produced printed circuit board.

Method for contacting a metallic contact pad in a printed circuit board and printed circuit board

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts&#x2014;connected thereto via leads&#x2014;for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element

An electronic switching element includes at least one semiconductor switch inserted into a layer sequence of a conductor structure element; and at least two busbars which are configured to contact-connect the at least one semiconductor switch, wherein the at least two busbars run substantially above one another in the layer sequence of the conductor structure element.

Electronic switching element and modularly constructed power converter

A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method

Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

Conductor-structure element having an internal layer substrate laminated into same, and method for the production thereof

A printed circuit board element (LP) having at least one electronic switching element () integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches () introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars () formed to contact the semiconductor switches (), wherein the busbars () run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C, C, C, C) arranged between the two busbars () is introduced into the layer sequence of the printed circuit board element (LP).

Printed circuit board element with integrated electronic switching element, power converter and method for producing a printed circuit board element

Electronic component having a first lead frame consisting of an electrically conductive material. The first lead frame carries a first semiconductor component. In the plane of the lead frame a shunt element is arranged, wherein the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact. An electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element. A current measurement with good accuracy is facilitated.

Electronic component having a lead frame consisting of an electrically conductive material

An electronic sub-assembly () comprising at least one electronic component () embedded in a sequence of layers, wherein the electronic component () is arranged in a recess of an electrically conductive central layer () and directly adjoins a resin layer () on each side.

Electronic sub-assembly and method for the production of an electronic sub-assembly

An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

Electronic assembly group and method for producing the same

The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component () which is arranged on an upper side of an electrically conductive intermediate plate () such that a connector pad () of the semiconductor component () is electrically contacted with the intermediate plate () and comprising a second semiconductor component () which is arranged on a lower side of the intermediate plate (). The second semiconductor component () comprises a first connector pad () and a second connector pad (), wherein both connector pads () are aligned in the direction of the intermediate plate () and wherein the first connector pad () is contacted with the intermediate plate (), and wherein the second connector pad () is not contacted with the intermediate plate (). Moreover, the invention relates to a method for producing such a printed circuit board element.

Printed circuit board element and method for producing a printed circuit board element

Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly

A method of producing a printed circuit board () with a plurality of inlays (), having the following steps: supplying a plurality of inlays (), of which at least one inlay has at least one positioning element (to); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess () for accommodating inlays, wherein, prior to the step of the plurality of inlays () being inserted, the recess () is defined in an uppermost layer () by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays () into the recess () defined by the frame; covering the inlays () with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (to) which establish a conductive contact between neighboring inlays.

Method for producing a circuit board and circuit board

The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

Growing community of inventors

Dunningen, Germany

Thomas Gottwald