Intermedics Inc.

Thomas G Sosebee

Philip H Chen

Kenneth R Ulmer

Dennis M Gibson

Xiaohai T He

Philip A Chen

Scott A Armstrong

A sub-assembly module for surface mounting on an implantable medical device hybrid module is provided. The sub-assembly module includes one or more electronic components mounted on a substrate. Interconnection between the electronic components and the hybrid module is established by bond pads on the upper and lower surfaces of the substrate and thru-substrate conducting plugs connecting respective upper and lower bond pads. The electronic components are encapsulated in a layer of insulating material. The electronic components may be chip-and-wire mounted to the sub-assembly module and the sub-assembly module may, in turn, be surface mounted to the hybrid module, permitting the integration of chip-and-wire and surface mount processing for a given hybrid module.

Semiconductor device packaging and method of fabrication

An implantable cardiac defibrillator is provided. The implantable cardiac defibrillator includes a can, a storage cell for powering the defibrillator, and a circuit module disposed in the can for controlling the defibrillator. The circuit module has a first substrate, a first die coupled to the first substrate, a second die, and a second substrate coupled to and disposed between the first die and the second die. The second substrate has a first plurality of conductors to carry electrical signals to and from the first die and a second plurality of conductors to carry electrical signals to and from the second die. The die may be any of a number of types of electronic components, such as power transistors, memory chips, or others. The stacking of the die saves board space, allowing for further miniaturization or incorporation of additional electronic components.

Implantable defibrillator with stacked transistor subassemblies

Growing community of inventors

Lake Jackson, TX, United States of America

Thomas G Sosebee