Qualitau, Inc.

Thomas G Bensing

Maurice C Evans

Jens Ullmann

Adalberto M Ramirez

Robert J Sylvia

Jacob Herschmann

A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one 'well' location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).

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Sunnyvale, CA, United States of America

Thomas G Bensing