Amp LLC

The Whitaker Corporation

Thomas Francis Davis

Lewis Brian Lerner

Thomas E Brown

Richard M Wagner

David Kahn

James F Iannella

A method and apparatus for injection molding several different parts in a reconfigurable mold is disclosed. The mold machine (10) includes a first mold body (14) attached to a machine frame (12) and second and third mold bodies (16, 18) that are movable with respect to the first mold body (14). A mold frame controller (100) is interconnected to and controls three linear actuators (56, 66, 88) that are arranged to move the three mold bodies into different configurations. Each mold body has mold cavities (24, 44, 46, 80) that can be aligned with mold cavities in the other mold bodies to form different combinations for forming a variety of different parts.

Method and apparatus for injection molding of selected parts

A distributed element filter member (10) comprises a semi-conductor member (12) having a composite dielectric layer (24) disposed on and secured to a first major surface (16) of the member (12), the layer (24) being comprised of a polymerized dielectric material made of either barium titanate or strontium titanate particles in various ranges of mixture; a conductive layer (34) is disposed on portions of the dielectric layer defining an outer ground conductor and an inner conductive layer (36) is disposed on a second major surface of the semi-conductor member defining a signal conductor. The polymer utilized may be selected from an aqueous solution containing acrylic styrene as a copolymer or a solid polyester dissolved in carbitol acetate, or a solid bisphenol A-based epoxy resin dissolved in butyl carbitol acetate with various mixtures of barium or strontium titanate utilized. A filter (12') embodiment includes three layers of polymerized material.

RF filter having composite dielectric layer and method of manufacture

An integrally molded electrical connector 10 for interconnecting an array 60 of conductors of a first article 58 with a corresponding array 64 of conductors of a second article 62 includes a plurality of substantially rigid bifurcated tines joined by a bight section 30, each tine having arm portions 18, 24 deflectable toward each other; and compressible support means 46 extending between the arm portions 18, 24 of the tines 16; and continuous circuit means 36 defined along outer surfaces of tine arm portions 18, 24 and bight section 30. The array of tines is formed from a dielectric material. The compressible support means 46 has sufficient durometer to maintain contact normal force between the continuous circuit means 36 and the corresponding contact means of opposed first and second electrical articles 58, 62 upon the arm portions 18, 24 being compressively held between the pair of electrical articles 58, 62.

Multicircuit connector assembly

An electronic assembly is disclosed comprising a molded dielectric connector means including an electronic package mounted therewithin, the connector means 80 being adapted to be secured to a framework. The connector means includes first and second molded member 82,110 securable together at an interface. The first molded member has outwardly facing surface portion including an interconnection region 94, and includes compliant spring portions 90 integral therewith portions and extending outwardly therefrom at the interface. The compliant spring portions 90 are adapted to be deflected by the second molded member 110 upon assembly of the molded members. Circuit means 92 are included on the first molded member 82 and are defined along the outside surface portions and extending along outwardly facing surface portions of the compliant spring portions 90 and further extending to interconnection region 94. The second molded member 110 includes a portion engagable with the compliant spring portion 90 and circuit means 164, defined on said engagable portion. Upon assembly of the first and second molded members the conductive portions 164 of the second molded member 110 are held under compression against the spring circuit surface 91 and upon mounting the assembly to said framework, the interconnection section 94 of the first molded member circuitry is electrically connected to corresponding contact means along the framework. In the preferred embodiment, resilient member 93 is used to support the spring arm portions 90 to minimize stress on the spring portions 90.

Panel mounted electronic assembly

The molded connector 10 includes a dielectric housing 12 having a transverse wall 14 with a plurality of apertures 20 extending therethrough and first and second molded sections 24, 32 extending outwardly from the periphery of and at opposite ends of respective apertures 20, the corresponding first and second molded sections 24, 32 being associated with each other and including first surface portions 26, 34 extending continuously from a common sidewall 22 of the respective aperture 20. The first and second molded sections 24, 32 include an inner dielectric core integrally molded with the housing wall 14 and at least one layer 40 of plating disposed on first surface portions 26, 34 thereof and along the respective common aperture sidewall 22 thereby defining first and second contact sections 42, 46 connected by a continuous conductive surface 44 extending therebetween. The first and second molded sections 24, 42 are adapted to interconnect first and second contact means in engagement with the first and second contact sections 42, 46 respectively. In the preferred embodiment at least one contact section is a complient beam and the plating thereon strengthens the beam such that the beam provides sufficient compression force to maintain electrical contact with a mating article without the need for elastomeric support.

Molded electrical connector having integral spring contact beams

Electrical contact device such as a terminal or a contact surface, has electrodeposited nickel thereon. The crystallites of the nickel are preferentially oriented with at least 50 percent of the volume {100} atomic planes substantially parallel to the contact surface. For many purposes, the preferentially oriented nickel surface is comparable to a gold plated contact surface.

Nickel plated contact surface having preferred crystallographic

An anode assembly 30 for selectively plating contact areas 102 on the interior surface of cathodically charged socket terminals 96 is disclosed, which comprises a conductive body member 32 having an anode means or member 54 extending forwardly from a body section 38, a dielectric body member 58 adapted to be secured to a forward portion 34 of said conductive body member 32 and having a passageway 62 therethrough for receiving the anode means 54; sheath means 64 extending forwardly from the dielectric body member and along the anode means 54 and extending angularly around at least one selected circumferential portion thereof, and lateral edge surfaces 68 of the sheath means 64 defining at least one slot 70 extending axially along the anode means 54 such that at least one axially extending portion 55 of the anode means 54 is exposed along the slot 70, the sheath means 64 having a diameter smaller than the inner diameter of a terminal 96 to be plated; and means for securing said dielectric body member 58 to said forward portion 34 of said conductive body member 32. Upon moving the sheathed anode means 54 into the interior of an electrical terminal 96, supplying plating solution upon the exposed anode portion 55 of the anode means 54, and providing an electrical current flow from the anode means 54, through the plating solution and into the cathodically charged terminal 96, a layer of plating is selectively deposited on the internal surface portion 102 of the terminal 96 that is generally aligned with the at least one exposed anode portion 55, the sheath means 64 providing a barrier to prevent plating on the remaining internal terminal surface portions.

Anode assembly for selectively plating interior surfaces of electrical

An aqueous bath useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative; the bath solution contains stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as an agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

Method for immersion deposition of tin and tin-lead alloys

Electroless tin and tin-lead alloy plating baths

An electroless plating process for copper in an acidic bath whereby copper by a chemical reduction process is continuously being plated to a desired thickness on a suitable substrate; this process is especially applicable to plating of copper and substrates which are susceptible to alkaline solutions such as polyimides, polyparabanic acids, etc.

Process for electroless copper deposition from an acidic bath

Salt compositions and baths thereof useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount of from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative. Preferably the salt elements are stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as a agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

Palladium is electrodeposited from an aqueous bath comprising Pd (NH.sub.3).sub.2 (NO.sub.2).sub.2 and tetrapotassium pyrophosphate at a pH of 8.5-11. Such a composition permits higher efficiencies to be obtained.

High efficiency palladium electroplating process, bath and composition

Disclosed are methods and electrolytes for the electrodeposition of a gold alloy containing 0.05 to 0.4 per cent by weight of cobalt. The electrolytes comprise aqueous acidic solutions containing nitrilotriacetic acid.

Method, electrolyte and additive for electroplating a cobalt brightened

A method for electroplating tin-lead compositions, a bath for electroplating of tin-lead alloys and stable, solid salt compositions for make up of a bath for plating the tin-lead alloys, said bath contains, besides the two metals, thiourea, potassium, hypophosphite and hydrochloric acid with the pH of the bath being from 0.5 to 1.5.

Tin-lead acidic plating bath

A method and electrolyte for electrodepositing a corrosion -- resistant, soft and ductile tin -- nickel alloy. A typical electrolyte is an aqueous solution of tin salts, nickel salts, thiourea, sodium hypophosphite, hydrochloric acid, and ammonium chloride and has a pH of 0.7 to 1.5.

Growing community of inventors

Harrisburg, PA, United States of America

Thomas Francis Davis