Basf Aktiengesellschaft

Cytec Technology Corporation

Thomas Folda

Helmut Tesch

Thomas Weber

Jack D Boyd

Roland Peter

Philipp Eisenbarth

Hans G Recker

Walter Heckmann

Herbert Stutz

Wolfgang Eberle

Hans-Gert Recker

Thomas Allspach

Volker Altstaedt

J Timothy Hartness

The incorporation of 2 to 35 .mu.m particles of a differentially soluble engineering thermoplastic into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45. Ksi 310 MPa after a 1500 in-lb/in impact.

Toughened thermosetting structural materials

The incorporation of 2 to 25 .mu.m particles of a limited class of polyimides having appreciable nonaromatic character into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45 Ksi after a 1500 in-lb/in impact.

Heat-curable resins which are suitable for fabricating carbon fiber prepregs and fiber composites by winding and resin transfer molding contain a bismaleimide, an alkenylphenol and N-vinylpyrrolidone.

Heat-curable bismaleidmide/alkenyl phenol/N-vinyl pyrrolidone resin

Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

Heat-curable bismaleimide resins

A curable impact modified epoxy resin mixture suitable for producing high performance composites is composed of

Curable impact modified epoxy resin having stabilized multiphase

Heat curable epoxy resin systems are disclosed which may be cured to form monophasic matrix resins and adhesives which, when utilized as matrix resins in carbon fiber reinforced composites, are capable of forming quasiisotropic panels having CAI values greater than 275 MPa after an impact of 6.68 kJ/m, and which maintain their tack after extended storage at room temperature.

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Neuleiningen, Germany

Thomas Folda