Continental Teves, Ag and Company Ohg

Thomas Fischer

Jakob Schillinger

Dietmar Huber

Stefan Günthner

Lothar Biebricher

Michael Schulmeister

Marco Benner

Waldemar Baumung

Stefan GÜNTHNER

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Structure-borne noise decoupling on sensors working with transmitter fields

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Sensor production by holding the intermediate injection-molded part

A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Sensor element for a motor vehicle

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: &#x2014;arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and &#x2014;encapsulating the electronic component with the encapsulation material.

Method for producing an electronic assembly

A sensor having at least one sensor element (), at least one signal processing element (), and a housing () which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means () on which the at least one sensor element () and the signal processing element () are arranged and are electrically connected to the carrier means. The carrier means () is also at least electrically connected to the electrical interface.

Growing community of inventors

Frankfurt am Main, Germany

Thomas Fischer