Infineon Technologies Ag

Roche Diagnostics Operations, Inc.

Roche Molecular Systems, Inc.

Roche Diagnostics Gmbh

F. Hoffmann-la Roche Ag

Thomas Fischer

Carsten Ahrens

Andre Schmenn

Damian Sojka

Herbert Von Der Eltz

Hermann Wendt

Frank Bergmann

Walter Eberle

Gudrun Stranzl

Gerald Lackner

Uwe Hoeckele

Walter Leitgeb

Eloisa Lopez-Calle

Josef Roedl

Michael Lecher

Edward Fuergut

Alexander Heinrich

Dietrich Bonart

Christoph Boehm

Bernhard Weidgans

Dieter Mangold

Roland Hampp

Thorsten Brueckner

Anton Steltenpohl

Tobias Schmidt

Joachim Mahler

Markus Zundel

Dieter Heindl

Evelyn Napetschnig

Sebastian Schmidt

Uwe Seidel

Juergen Spinke

Rolf Lerch

Sascha Lutz

Daniel Porwol

Peter Sluka

Markus Menath

Thorsten Schedel

Heiko Hommen

Ulrike Fastner

Juergen Klepp

Thomas Dolbinow

Juergen Schaeffler

Thomas Manuel Keller

Sebastian Heimerl

Ralf Otto

Sabrina Adler

Erik Beiersdorf

Domenik Wensorra

Konrad Kuerzinger

Pamela Espindola

Hans-Peter Josel

Hermann Gruber

Werner Robl

Martin Ostermayr

Anton Prueckl

Raimund Foerg

Franco Mariani

Thomas Froehlich

Ettore Amirante

Alfons Nichtl

Peter Huber

Gerhard Hiller

Michael Larisch

Matthias Schmidt

Heinz Opolka

Ewelina Hegel

Karl Schumacher

Sebastian Bernrieder

Andreas Bauer

Isabella Goetz

Jürgen Klepp

Anja Reitmeier

Juergen Foerster

Andreas Stueckjuergen

Anja Gissibl

Caroline Bylda

Martina Hösch

Christoph Kamseder

Sebastian Werner

Dieter Hendl

A medical system for determining an analyte quantity in a blood sample via a cartridge that spins around a rotational axis. The cartridge may include: a separation chamber that separates blood plasma from the sample; a processing chamber containing a reagent with a specific binding partner which binds to the analyte to form an analyte specific binding partner complex; a first valve structure connecting the separation chamber to the processing chamber; a measurement structure to measure the quantity of the analyte, wherein the measurement structure includes a chromatographic membrane with an immobilized binding partner for direct or indirect binding of the analyte or the analyte specific binding partner complex, and an absorbent structure that is nearer to the axis than the membrane; a second valve structure connecting the processing chamber to the measurement structure; and a fluid chamber filled with a washing buffer and fluidically connected to the measurement structure.

Determining a quantity of an analyte in a blood sample

A package includes: an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements; and an encapsulant encapsulating the dielectric layer and the semiconductor die. The encapsulant is a mold compound having different material properties than the dielectric layer. A method of manufacturing package is also described.

Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component

In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

Method and apparatus for use in wafer processing

An electronic component includes a mold layer and a semiconductor die including a low ohmic first portion and a high ohmic second portion. The low ohmic first portion has an active area. The high ohmic second portion is arranged on the mold layer.

Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer

The present disclosure relates to a set of at least 100 single-stranded oligonucleotide probes directed against (or complementary to) portions of a genomic target sequence of interest. The present disclosure also relates to a method of detecting a genomic target sequence of interest using the set of oligonucleotide probes and a method of generating the set of oligonucleotide probes. Further, the present disclosure relates to a kit comprising the set of oligonucleotide probes and at least one further component.

Set of oligonucleotide probes as well as methods and uses thereto

The present disclosure relates to an in vitro method for releasing analytes from a sample involving contacting the sample with (i) a chaotropic agent, (ii) an organic solvent, (iii) a detergent, and (iv) at least one agent providing bicarbonate ions. The present disclosure further relates to a release agent for releasing analytes from a sample having the aforesaid compounds. Moreover, the present disclosure relates to uses, kits, methods and devices related to the method and the release agent of the present disclosure.

Generic pretreatment reagents for analyte determinations

A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

The present disclosure relates to a set of at least 100 single-stranded oligonucleotide probes directed against (or complementary to) portions of a genomic target sequence of interest. The present disclosure also relates to a method of detecting a genomic target sequence of interest using the set of oligonucleotide probes and a method of generating the set of oligonucleotide probes. Further the present disclosure relates to a kit comprising the set of oligonucleotide probes and at least one further component.

An apparatus which comprises an expansion unit configured for expanding a foil, and a mounting unit configured for subsequently mounting the expanded foil on a frame and a workpiece, in particular a wafer, on the expanded foil.

Frame mounting after foil expansion

A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

Separation of workpiece with three material removal stages

An apparatus for inspecting a plurality of electronic chips singularized from a wafer, wherein the apparatus comprises an electromagnetic radiation source arranged and configured for illuminating at least part of a first main surface of the singularized wafer with electromagnetic radiation, and a detection unit configured for detecting electromagnetic radiation from a side facing a second main surface of the singularized wafer and opposing the first main surface.

Electronic chip inspection by backside illumination

In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a contact layer over a first major surface of a substrate. The substrate includes device regions separated by kerf regions. The contact layer is disposed in the kerf region and the device regions. A structured solder layer is formed over the device regions. The contact layer is exposed at the kerf region after forming the structured solder layer. The contact layer and the substrate in the kerf regions are diced.

Semiconductor devices and methods of forming thereof

A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.

According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.

Semiconductor device

Growing community of inventors

Wuppertal, Germany

Thomas Fischer