Honeywell International Inc.

Alliedsignal Inc.

Tonoga Inc.

Other

Thomas F McCarthy

Yan Chen

David B Schwind

Eric J Rainal

Gordon C Smith

Michael W Wagaman

David L Wynants, Sr

Peter William Petersen

A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Low signal loss bonding ply for multilayer circuit boards

Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula ofare provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ('Tg'), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Preparation of polyindanebisphenols and polymers derived therefrom

A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.

Highly stable packaging substrates

A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Poly(chlorotrifluoroethylene/vinylidenefluoride/vinylester) copolymers with excellent long term ultraviolet light resistance

Poly (chlorotrifluoroethylene/vinylidenefluoride/vinylester) copolymers with excellent long-term ultraviolet light resistance

The present invention provides a novel, optionally surfactant-free process for controlling particle number, particle size, and/or particle size distribution. The method of the invention also significantly improves monomer to polymer conversion rates, as well as, increases the level of polymer solids which can be emulsified/dispersed in water without polymer flocculation. Specifically, the improved process provides an aqueous dispersion of up to about 48% polymer solids in water in the absence of surfactant. The resulting fluoropolymers dispersions may be used in resin and coating applications.

Method of manufacturing fluoropolymers

Flame retardant benzocyclobutene resin with reduced brittleness

Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of ##STR1## are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ('Tg'), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

This invention relates to novel room temperature coalescable aqueous fluoropolymer dispersions and a process for their manufacture. These dispersions may be used in a variety of applications including high temperature thermoplastic coatings, polishes, room temperature formable paints and coatings, extrudable or injection moldable resins, and adhesives.

Growing community of inventors

Bennington, VT, United States of America

Thomas F McCarthy