Sandvik Ab

Telefonaktiebolaget Lm Ericsson (publ)

Silex Microsystems Ab

Sandvik Limited

Thomas Ericson

Paul Asger Eriksen

Jan &angst;kerman

Udo K Fischer

Thorbjörn Ebefors

Edvard Kälvesten

Niklas Svedin

Carl-Johan Maderud

Christian Vieider

Göran Palmskog

Peter Agren

Lennart Bäcklin

Mats Granberg

Krister Fröjdh

Pontus Lundström

Christian Vjeider

Krister Fröjd

Jan ANGkerman

A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.

Via structure and method thereof

The present invention is related to a method and device for precision and passive alignment such as precision and passive alignment technology for low cost array fibre access components. A laser carrier is passively aligned to an MT-interface using alignment structures on a replicated carrier. The laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides.

Method and device for passive alignment

There is now provided a cemented carbide grade for rock excavation purposes with 88-96 weight % WC, preferably 91-95% weight % WC, with a binder phase consisting of only cobalt or cobalt and nickel, with a maximum of 25% of the binder being Ni, possibly with small additions of rare earth metals, such as Ce and Y, up to a maximum of 2% of the total cemented carbide. The WC grains are rounded because of the process of coating the WC with cobalt, and not recrystallized or showing grain growth or very sharp cornered grains like conventionally milled WC, thus giving the bodies surprisingly high thermal conductivity. The average grain size should be from 8-30 &mgr;m, preferably from 12-20 &mgr;m. The maximum grain size does not exceed 2 times the average value and no more than 2% of the grains found in the structure are less than half of the average grain size.

Cemented carbide body with improved high temperature and thermomechanical properties

There is now provided a cemented carbide grade for rock excavation purposes with 88-96 weight % WC, preferably 91-95% weight % WC, with a binder phase consisting of only cobalt or cobalt and nickel, with a maximum of 25% of the binder being Ni, possibly with small additions of rare earth metals, such as Ce and Y, up to a maximum of 2% of the total cemented carbide. The WC grains are rounded because of the process of coating the WC with cobalt, and not recrystallized or showing grain growth or very sharp cornered grains like conventionally milled WC, thus giving the bodies surprisingly high thermal conductivity. The average grain size should be from 8-30 .mu.m, preferably from 12-20 .mu.m. The maximum grain size does not exceed 2 times the average value and no more than 2% of the grains found in the structure are less than half of the average grain size.

Cemented carbide body with improved high temperature and

There is now provided a roll for hot rolling comprising 70-95 weight %, preferably 85-94 weight %, WC in a binder phase consisting of only cobalt or alternatively a Co--Ni--Cr alloy containing 20-35 weight % Ni and up to 10 weight % Cr, possibly with small additions of molybdenum. The WC grains are rounded with an average grain size between 3-10 .mu.m, preferably 4-8 .mu.m. The maximum grain size should not exceed 2 times the average grain size and no more than 2% of the grains be less than half of the average grain size.

Roll for hot rolling with increased resistance to thermal cracking and

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Hägersten, Sweden

Thomas Ericson