Bae Systems Information and Electronic Systems Integration Inc.

Thomas E Love

John A Hughes

Christopher Ebel

Eugene Lemoine

David H Lee

Keith K Sturcken

Sheila J Konecke

Peter M Wallace

Jeffrey Montag

A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

Devices and methods for stacking individually tested devices to form multi-chip electronic modules

A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder 'bumps,' which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

System and method for multi-chip module die extraction and replacement

Growing community of inventors

Gainesville, VA, United States of America

Thomas E Love