International Business Machines Corporation

Thomas Donald Kidd

John Richard Dangler

Matthew Stephen Doyle

David J Braun

Jason Thomas Stoll

Mark Kenneth Hoffmeyer

Phillip Duane Isaacs

Mark Garrison Clark

Gerald Keith Bartley

James D Bielick

Miles Frank Swain

David Allen Sluzewski

Joseph Paul Kuczynski

Timothy Jerome Tofil

Paul Eric Dahlen

Kevin Albert Splittstoesser

Timothy Roy Block

David Peter Gaio

Kevin J Przybylski

Dennis L Karst

Timothy L McMillan

Bradley Lewis Martin

Charles J Guenther

Jeffrey L Stone

Bradley H Redfield

Michael W Leddige

An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Wiper control mechanism

A method to reduce refreezing of meltable snow includes configuring a wiper arm to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The method also includes configuring a sensor coupled to the wiper arm to gather and transmit a parameter on the vehicle and environment. The method also includes configuring a processor to receive the parameter, determine refreezability of the meltable snow based on the parameter, and define an action to be performed by the wiper arm.

A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Debug probing device and technique for use with flexible rework device

A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly.

Flexible rework device

A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Method for manufacturing split flex cable

A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.

Implementing impedance gradient connector for board-to-board applications

Split flex cable

A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Flexible multilayer printed circuit assembly with reduced EMI emissions

In a flat flex cable, signal lines are surrounded by logic ground planes above and below which are viaed together left and right. The ground planes coupled with the flex cable dielectric determine characteristic the impedance and attenuation of the cable and provide differential signal EMI shielding. All signal layers and logic ground planes are enclosed within the two outermost shield layers which are viaed together left and right and around the connectors to enclose both signal layers and logic ground planes to provide common mode EMI shielding.

Flexible cable interconnect with integrated EMC shielding

A flex cable is slit between conductor traces to provide conformable strips, at least one of which can be flipped to expose one of the conductor traces to the other side of the cable. This increases the design flexibility of the flex cable because the conductor traces can be exposed on both sides of the cable without laser ablation or etch operations to remove the substrate. Also, because the flex cable is slit along its length, it is more able to conform to different connector locations, thereby obviating the need for designing a different flex cable to accommodate changes in mating hardware.

Flex cables with increased three-dimensional conformity and design flexibility

A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.

High performance pad on pad connector for flex circuit packaging

A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

Application of low temperature metallurgical paste to form a bond

Attachment of electronics to optical devices is made by supporting the optical devices on a heat spreader card and the electronics on a separate circuit card. Each card has at least a first major surface, with an optical transducing subassembly mounted perpendicularly from the major surface of the heat spreader card. Electronics, except for transducing elements, are placed on the circuit card. The only direct attachment between the circuit card and the heat spreader card is one or more flexible cables attached to the respective major surfaces. This arrangement mechanically isolates the circuit card from the heat spreader card. The flexible cables include electrical conductors held positionally in a polyimide matrix, which provides for thermal isolation of the heat spreader card and the circuit card.

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Stewartville, MN, United States of America

Thomas Donald Kidd