Applied Materials, Inc.

Applied Materials Gmbh & Co Kg

Thomas Deppisch

Stefan Bangert

Jürgen Henrich

Neil Morrison

Hans-Georg Lotz

Andreas Sauer

Wolfgang Buschbeck

Andreas Lopp

Gerd Hoffmann

Roland Trassl

Frank Schnappenberger

Volker Hacker

Uwe Hermanns

Anke Hellmich

Manfred Englert

Mathew Dean Allison

Claire Armstrong

Thomas Koch

Ralf Scheidt

Franz-Josef Helle

Götz Görisch

Torsten Bruno Dieter

Dirk Wagner

Annemarie Flock

A vapor deposition apparatus is provided. The vapor deposition apparatus includes a tank for providing a liquefied material, a first unit having an alterable first volume, the first unit including a first actuator and including a first line to be in fluid communication with the tank. Further, the vapor deposition apparatus includes a second unit having an alterable second volume, the second unit including a second actuator and including a second line to be in fluid communication with the tank. The vapor deposition apparatus includes an evaporation arrangement, the evaporation arrangement being in fluid communication with the first unit and the second unit. The first actuator and the second actuator are configured to alternatingly provide a force to the alterable first volume and the alterable second volume for providing the liquefied material to the evaporation arrangement.

Apparatus for providing a liquefied material, dosage system and method for dosing a liquefied material

A roller for transporting a flexible substrate is described. The roller includes a first coolant supply for cooling a first part of the roller and a second coolant supply for cooling a second part and a third part of the roller. The first part is provided between the second part and the third part. Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

Roller for transporting a flexible substrate, vacuum processing apparatus, and method of cooling a roller

A method () of cooling a deposition source () is described. The method includes stopping () depositing material from the deposition source, the deposition source being arranged in a deposition chamber (), and introducing () a cooling gas into the deposition chamber (), the cooling gas comprising a thermal conductivity &#x3bb; of &#x3bb;&#x2265;0.05 [W/(m*K)]. Further, a chamber for cooling a deposition source is described. The chamber includes a deposition source being arranged in the chamber. Further, the chamber includes a cooling gas supply system configured for providing a cooling gas into the chamber, the cooling gas comprising a thermal conductivity &#x3bb; of &#x3bb;&#x2265;0.05 [W/(m*K)].

Method of cooling a deposition source, chamber for cooling a deposition source and deposition system

A method of coating a flexible substrate in a roll-to-roll deposition system is described. The method includes unwinding the flexible substrate from an unwinding roll, the flexible substrate having a first coating on a first main side thereof; measuring a lateral positioning of the first coating while guiding the flexible substrate to a coating drum; adjusting a lateral position of the flexible substrate on the coating drum depending on the measured lateral positioning of the first coating; and depositing a second coating on the flexible substrate, particularly on a second main side of the flexible substrate opposite the first main side. Further described is a vacuum deposition apparatus for conducting the methods described herein.

Method of coating a flexible substrate in a R2R deposition system, and vapor deposition system

A method for controlling a gas supply to a process chamber is provided. The method includes: measuring a gas parameter by each of two or more sensors provided in the process chamber; determining a combined gas parameter from the measured gas parameters; and controlling the gas supply to the process chamber based on the determined combined gas parameter.

Method for controlling a gas supply to a process chamber, controller for controlling a gas supply to a process chamber, and apparatus

According to the present disclosure, a flexible substrate coating apparatus is provided. The flexible substrate coating apparatus includes a vacuum process chamber for processing a flexible substrate. The vacuum process chamber includes one or more deposition units and a cleaning unit positioned directly downstream of the one or more deposition units. In another aspect, a method for depositing a thin-film on a flexible substrate is provided. The method for depositing a thin-film on a flexible substrate includes vacuum coating of the flexible substrate, thereby depositing one or more layers on the flexible substrate, and cleaning the flexible substrate directly downstream of the coating.

Apparatus and method for thin-film processing applications

A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.

Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel

A method of controlling a reactive deposition process and a corresponding assembly and/or apparatus are described. The method includes providing power to a cathode with a power supply, providing a voltage set point to the power supply, receiving a power value correlating the power provided to the cathode, and controlling a flow of a process gas in dependence of the power value to provide a closed loop control for the power value.

Closed loop control

A layer stack for a touch panel is described. The layer stack includes a substrate including a polymer for depositing one or more layers on the substrate; a patterned transparent conductive oxide (TCO) layer provided over the substrate, which comprises areas of TCO and gaps between the areas of TCO; a first dielectric material provided in the gaps of the patterned TCO layer and a dielectric layer being deposited directly on the TCO areas of the TCO layer and directly on the first dielectric material. Further, a touch panel including a layer stack and a method for forming a layer stack for a touch panel is described.

Layer stack for a touch panel and method for forming a layer stack

A magnetic arrangement for a planar magnetron, in which an initial magnetic pole encompasses a second magnetic pole. This magnetic arrangement is moved linear in longitudinal direction to a target by a specific value and then moved back in opposite direction by the same value. In one version, an additional perpendicular motion is effected. The magnet arrangement is designed so that north and south pole interlock and waviform racetracks are generated. This enables constant sputtering from the entire target surface.

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Aschaffenburg, Germany

Thomas Deppisch