Rf360 Singapore Pte. Ltd.

Snaptrack Incorporated

Optipack Gmbh

Thomas Dengler

Thomas Bauer

Peter Hagn

Ansgar Schäufele

Cengiz Erdogan

Florian Habel

Klaus Wiesenbauer

Michael Leins

Günther Pahlitzsch

At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

Single substrate multiplexer

An improved DMS filter with electrode structures between a first port and a second port is provided. Wiring junctions are realized in multilayer crossing with dielectric material in between. There are insulating patches (L) between crossing conductor layers (L,L). Signal wirings may be realized with multiple conductor layers (L, L) to reduce wiring resistance and the upper conductor layer (L) of the signal wiring may partly overlap the insulating patches (L). The insulating patches (L) may extend over the acoustic path to achieve temperature compensation.

DMS filter, electroacoustic filter and multiplexer

A filter arrangement with a large bandwidth is specified, wherein a first and a second filter are connected in parallel between a first and a second node. Both filters are configured as DMS filters and both comprise two DMS tracks each, connected in series. The two filters have different center frequencies and create a common passband together.

Saw filter with a large bandwidth

Growing community of inventors

Munich, Germany

Thomas Dengler