Kulicke and Soffa Industries, Inc.

Thomas Colosimo

Matthew B Wasserman

Ai Jun Song

Jeremy Neyhart

Benjamin D Trabin

Ting-Chia Huang

Tao-Hua Lee

A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.

Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

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West Chester, PA, United States of America

Thomas Colosimo