International Business Machines Corporation

Thomas Carl Clarke

Robert Fontana

Richard Hsiao

Hugo Alberto Emilio Santini

Eric James Lee

Gregory Breyta

Daniel Joseph Dawson

Alfred Floyd Renaldo

Caroline A Kovac

Jae M Park

Richard R Thomas

Dae Young Jung

Yaffa Tomkiewicz

Ronald P Esch

Neng H Lu

Ho M Tong

A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.

Embedded dual coil fabrication process

An antireflective composition includes a polyphenolic polymer which has a first repeating unit and a second repeating unit of the formula:

Antireflective polymer and method of use

Embedded dual coil planar structure

A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.

Method for preparing substrates for deposition of metal seed from an

A method is disclosed for the manufacture of void-free prepregs formed by the impregnation of a reinforcing cloth (e.g. glass fiber cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the method, the reinforcing cloth is first prewetted with a liquid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepregs are used in the manufacture of printed circuit boards.

Process for the production of void-free prepreg sheets

Growing community of inventors

Morgan Hills, CA, United States of America

Thomas Carl Clarke