Westech Systems, Inc.

Rodel Inc.

Thomas C Hyde

Gerald L Gill, Jr

John V Roberts

A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.

Apparatus for interlayer planarization of semiconductor material

Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.

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Chandler, AZ, United States of America

Thomas C Hyde