E.i. Dupont De Nemours and Company

Dupont Teijin Films U.S. Limited Partnership

Thomas C Felder

Lynda Kaye Johnson

Reid John Chesterfield

Rinaldo Soria Schiffino

Jeffrey Scott Meth

Graciela Beatriz Blanchet

Feng Gao

Irina Malajovich

Geoffrey Nunes

Richard Kevin Bailey

John W Catron, Jr

Jonathan V Caspar

Roupen Leon Keusseyan

Dalen E Keys

Nancy G Tassi

Gerard O'Neil

Fredrick Claus Zumsteg, Jr

Robert William Eveson

Richard P Pankratz

Moira Logan

Christopher Ferguson

James R Joiner

Mark Andrew Harmer

Paul J Shannon

Elizabeth Forrester McCord

Gary Delmar Jaycox

Marc Bruce Goldfinger

Kenneth George Sharp

Howard David Glicksman

Karyn B Visscher

Gerald Donald Andrews

Charles Nehemiah McEwen

William J Marshall

Debra S Strickland

Richard Paul Pankratz

Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Donor elements and processes for thermal transfer of nanoparticle layers

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

A donor element useful in an assemblage for imaging by exposure to light comprises a support layer, a light-to-heat conversion layer disposed adjacent the support layer containing a light absorber, and a transfer layer disposed adjacent the light-to-heat conversion layer opposite the support layer. The donor element also includes a release-modifier disposed between the support layer and the transfer layer.

Donor element with release-modifier for thermal transfer

The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

A donor element useful in an assemblage for imaging by exposure to light comprises a support layer formed by a stretching process, a light-to-heat conversion layer disposed adjacent the support layer containing a light absorber, and a transfer layer disposed adjacent the light-to-heat conversion layer opposite the support layer. The light-to-heat conversion layer is coated on the support prior to completion of the stretching process.

Donor element for thermal transfer

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Kennett Square, PA, United States of America

Thomas C Felder