Robert Boschgmbh

Akustica, Inc.

Thomas Buck

Stefan Leidich

Franz Laermer

Fabian Purkl

Andrew Jonathan Doller

Andreas Merz

Benedikt Stein

Christoph Schelling

Rolf Scheben

Thorsten Pannek

Michael Stumber

Jochen Zoellin

Frank Reichenbach

Gustav Klett

Bernhard Gehl

Ulrike Scholz

Kerrin Doessel

John William Zinn

Oliver Krayl

Yujie Zhang

Joerg Muchow

Ricardo Ehrenpfordt

Fabian Utermoehlen

Tjalf Pirk

Markus Ulm

Stefano Delfini

Christian Huber

Roland Mueller-Fiedler

Florian Schoen

Arnim Hoechst

Ralf Reichenbach

Ingo Herrmann

Christina Leinenbach

Marian Keck

Jochen Hoffmann

Mathias Reimann

Brett Mathew Diamond

Christoph Daniel Kraemmer

Reinhold Roedel

Daniel Pantel

Sonja Knies

Gerd Scheying

Martin Husnik

Dayo Oshinubi

Ahmad Mansour

Wenqing Liu

Marc Schmid

Nicola Mingirulli

Kathrin Van Teeffelen

Andy Doller

Wolfgang Pleuger

Joachim Loeblein

Thomas Northemann

Fabian Purki

Alberto Arias-Drake

Juan Ramos-Martos

Antonio Ragel-Morales

Joaquin Ceballos-Caceres

Anna Krause

Jose M Mora-Gutierrez

Kathrin Teeffelen

A measuring device for a fastening device includes a base body, a sensor unit configured to detect at least one fastening variable, and an interface connected to the sensor unit and configured to provide the detected at least one fastening variable to an external reading device. The interface is electrically connectable to a wireless communication unit or directly connectable to the external reading device.

Anchoring device

A spectrometer apparatus is disclosed that includes at least one light source for irradiating a sample with light, an optical detection device for detecting light scattered by the sample, at least one optical filter device, which is arranged in front of and/or behind the sample, a contact sensor device for determining a contact between the sample and the spectrometer apparatus and for outputting a corresponding output signal, a control device for controlling the light source and the detection device in response to the output signal. The control device is designed such that the control device modifies at least one operating parameter of the light source and the detection device, when the output signal indicates the contact between the sample and the spectrometer apparatus. A method for operating a spectrometer apparatus is disclosed as well.

Spectrometer apparatus and a corresponding method for operating a spectrometer apparatus

A coil assembly includes a coil winding and a multilayer printed circuit board. The coil winding has multiple loops that are arranged in different layers of the printed circuit board and form a main magnetic field with a main measuring direction perpendicular to a main plane of the printed circuit board. The loops arranged in different layers are electrically connected together via at least one via. The printed circuit board has at least four vias or a whole-number multiple of four vias that form an equal number of reverse current paths and forward current paths between the loops of the coil winding. Each pair of vias with the same current path direction is arranged point-symmetrically relative to a common mirror point such that magnetic loops that are formed on printed circuit board secondary planes arranged perpendicularly to the main plane have opposite directions and compensate for one another.

Coil assembly and corresponding measuring assembly

A method for determining a sensor coil inductance of an eddy current sensor using an LC oscillator circuit includes determining the sensor coil inductance via integration, as a function of an oscillation frequency and a resonance capacitance of the LC oscillator circuit. The method further includes detuning, at least once, the oscillation frequency during the integration.

Method and device for determining a sensor coil inductance

An angular position sensor includes a stator element with at least three coils, a rotor element rotatably mounted with respect to the stator element, and an evaluation unit configured to determine an angle of rotation between the rotor element and stator element. The rotor element is configured to inductively couple with each of the at least three coils with varying strengths based on the angle of rotation. The evaluation unit is further configured to supply the coils with alternating voltage in a cyclical manner and in sequence, so that a first respective part of the coils is supplied with alternating voltage and a remaining part is de-energized. The evaluation unit is additionally configured, in a cyclical manner in sequence with one or more de-energized coils, to detect at least one of a respective phase and an amount of an induced alternating voltage, and to determine the angle of rotation therefrom.

Angular position sensor

A signal processing device is usable in a communication system and includes a signal path, a signal detector, a signal synthesizer, a transmission unit, and a receive path including an analog-to-digital converter. The signal path transmits a transmission signal that was transmitted by the communication system and that contains a communication signal. The signal detector detects, and generates an activation signal in response to, an interference signal contained in the transmission signal and occurring due to narrowband interferences. The signal synthesizer generates an approximation signal for the interference signal upon the presence of the activation signal. The transmission unit receives the transmission signal transmitted by the signal path and the approximation signal, and outputs a difference signal between the transmission signal and the approximation signal. The analog-to-digital converter converts a signal generated based on the difference signal into a digital signal.

Signal processing device for a communication system usable in particular in a battery system

A micromechanical component having at least one electromechanical flexible structure, each of which includes a first piezoelectric layer, a first outer electrode situated on a first side of the first piezoelectric layer, a first intermediate electrode situated on a second side, oriented away from the first side, of the first piezoelectric layer, a second piezoelectric layer situated on a side of the first intermediate electrode oriented away from the first piezoelectric layer, and a second outer electrode situated on a side of the second piezoelectric layer oriented away from the first intermediate electrode, the at least one electromechanical flexible structure having in each case a second intermediate electrode that is situated on the side of the first intermediate electrode oriented away from the first piezoelectric layer, between the second piezoelectric layer and the first intermediate electrode.

Micromechanical component and production method for a micromechanical component

A sensor arrangement for contactless linear position detection includes a target having a measuring transducer running along a measuring path, and a magnetic field sensor arranged at a distance from the measuring transducer and in a relatively movable manner along the measuring path. The magnetic field sensor at least partially covers the measuring transducer. The measuring transducer is magnetically conductive. The magnetic field sensor includes a carrier having at least one measuring sensor with a two-dimensional or three-dimensional detection range, and at least one permanent magnet that generates a local magnetic field. The magnetic flux of the at least one permanent magnet is introduced into the measuring transducer, which includes an influencing device configured to influence the introduced magnetic flux based on a current position of the magnetic field sensor along the measuring path.

Sensor arrangement for contactless linear position detection

A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.

Micromechanical sound transducer system and corresponding manufacturing method

A MEMS microphone having a backplate, a spring, and a membrane. In one embodiment, the membrane is supported in an approximate center of the membrane via a support. The support is connected to the approximate center of the membrane and an approximate center of the backplate. The membrane is connected to a spring that provides an electrical connection. The membrane may be electrically biased via the electrical connection. One or more overtravel stops are fixed to the backplate and pass through an aperture of the membrane. The overtravel stops are configured to prevent movement of the membrane in a radial direction opposite to the backplate. The membrane includes a stress gradient, a corrugation, or another structure that sets or determines a stiffness of the membrane.

Center-fixed MEMS microphone membrane

For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

MEMS component including a sound-pressure-sensitive diaphragm element

A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path.

MEMS device with acoustic leak control features

A micro electrical mechanical system (MEMS) device in one embodiment includes a substrate defining a back cavity, a membrane above the back cavity, a back plate above the membrane, and a first overtravel stop (OTS) positioned at least partially directly beneath the membrane and supported by the back plate.

MEMS membrane overtravel stop

A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the MEMS microphone structural component; and a housing having a sound opening. The MEMS microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure. The ASIC structural component also includes a second MEMS microphone structure whose microphone signal is fed to the evaluation electronics.

Microphone component

Growing community of inventors

Tamm, Germany

Thomas Buck