Visteon Global Technolgoies, Inc.

Visteon Global Tech., Inc

Thomas Bernd Krautheim

Robert Edward Belke

Andrew Zachary Glovatsky

Lakhi Nandlal Goenka

Vivek Amir Jairazbhoy

Delin Li

Mohan R Paruchuri

Achyuta Achari

Brenda Joyce Nation

Robert Joseph Gordon

Jay DeAvis Baker

Cuong Van Pham

Richard Keith McMillan

William F Quitty, Jr

Myron Lemecha

Robert Edward Belke, Jr

Marc Alan Straub

Jun Ming Hu

Edward Paul McLeskey

Ram S Raghava

Daniel Roger Vander Sluis

Michael Allen Howey

A multi-layer electronic circuit board designhaving selectively formed apertures or cavitieswhich have improved solder-wetting characteristics.

Electrical circuit board and a method for making the same

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends across a substantial portion of the cockpit and defines a plurality of generally planar mounting sites and further defines at least one recess. At least one substrate is mounted to the beam and includes at least one area of the substrate populated by electronic components on both sides of the substrate. The area is aligned over the at least one recess, and an instrument panel cover is removably positioned over the substrate and the structure.

Vehicle instrument panel structure to support electronics packaging

In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.

Method for fabricating connectors for interconnecting etched tri-metal circuit structures

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

Method for making an electrical circuit board

A multi-layer electronic circuit board design having selectively formed apertures or cavities which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board , which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.

A method for making multi-layer electronic circuit boards having aperture which may be selectively connected to an electrical ground potential.

Method for making circuit board

A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed &ldquo;blind&rdquo; apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member

A method for forming connections within a multi-layer electronic circuit board . In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material

Circuit board and a method for making the same

A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Growing community of inventors

Belleville, MI, United States of America

Thomas Bernd Krautheim