Infineon Technologies Ag

Thomas Behrens

Joachim Mahler

Alexander Heinrich

Evelyn Napetschnig

Thorsten Meyer

Ivan Nikitin

Manfred Mengel

Martin Gruber

Thorsten Scharf

Bernhard Weidgans

Edmund Riedl

Reimund Engl

Oliver Eichinger

Catharina Wille

Lim Fong

Christina Yeong

Steffen Orso

Eung San Cho

Josef Hoeglauer

Xaver Schloegel

Rainald Sander

Andreas Grassmann

Peter Strobel

Stefan Landau

Rupert Fischer

Ivan Galesic

Eduard Knauer

Wolfgang Kuebler

A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.

Semiconductor device including a solder compound containing a compound Sn/Sb

A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

Processing of one or more carrier bodies and electronic components by multiple alignment

A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

Chip arrangements

In some examples, a device includes a semiconductor element, a layer element, and a single connector element electrically connecting the semiconductor element and the layer element. In some examples, the single connector element includes two or more discrete connector elements, and each discrete connector element of the two or more discrete connector elements electrically connects the semiconductor element and the layer element. In some examples, the single connector element also includes conductive material attached to the two or more discrete connector elements.

Reinforcement for electrical connectors

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Solder alloys and arrangements

A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.

Semiconductor device

A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.

Method of manufacturing a component comprising cutting a carrier

An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.

Integrated circuit device and method for the production thereof

A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer.

Semiconductor device including spacer element

An integrated circuit device includes a semiconductor chip with a metallization layer on the chip. A gas-phase deposited insulation layer is disposed on the metallization layer.

Integrated circuit device and method

A semiconductor module is disclosed. One embodiment provides a first semiconductor chip, a second semiconductor chip and a spacer. The first semiconductor chip has a depression at a first main surface. The spacer applied to the first main surface and at least partly fills the depression. The second semiconductor chip is applied to the spacer.

Semiconductor module

A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

Growing community of inventors

Wenzenbach, Germany

Thomas Behrens