Infineon Technologies Ag

Infineon Technologies Austria Ag

Thomas Beer

Ralf Otremba

Klaus Schiess

Georg Pelz

Hannes Mio

Norbert Elbel

Daniel Hoelzl

A semiconductor package includes: a leadframe having first, second and third die pads and leads, each die pad having upper and lower surfaces; first and second power semiconductor devices; a control semiconductor device; and a mold compound. The upper surface of each die pad is arranged within the mold compound. The lower surface of the second die pad is spaced apart from a side face of the semiconductor package by a distance that is greater than a length of the individual leads. The first power semiconductor device is mounted on the upper surface of the first die pad and electrically coupled to the second die pad by one or more first connectors extending between the first device and the upper surface of the second die pad. The upper surface of the second die pad is occupied by the one or more connectors or in direct contact with the mold compound.

Semiconductor package and method of manufacturing a semiconductor package

An electronic system includes a pixelated light source having a plurality of individually controllable pixels, a controller operable to control the pixelated light source, a photosensor configured to detect light signals emitted from the pixelated light source, and an analysis unit configured to recognize objects with different properties that pass in range of the pixelated light source and the photosensor, based on the light signals detected by the photosensor. Corresponding object recognition and material analysis methods are also described.

Method and device for object recognition and analysis

An integrated circuit device and method. A substrate having contacts has a plurality of capacitors thereon. A plurality of fusible links selectively connect the plurality of capacitors to one another and selected ones of the capacitors to the contacts. In this manner, for example, the capacitance value can be adjusted to tune an antenna mounted on the substrate during testing of the integrated circuit device.

Integrated circuit device including tunable substrate capacitors

Growing community of inventors

Mauerstetten, Germany

Thomas Beer