Starkey Laboratories, Inc.

Thomas Bartosh

Sidney A Higgins

Joel N Erdman

John Becker

Described are techniques for creating acoustic inlet manifolds for a microphone that utilize existing flex or printed circuit board (PCB) technology to create an ultra-low profile manifold. The described techniques: take advantage of the ability to allow reflow connection. By embedding an acoustic path between the layers or creating an acoustic path on the surface of a flex or PCB assembly, the microphone can be reflowed onto the manifold assembly.

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Minneapolis, MN, United States of America

Thomas Bartosh