Ford Motor Company Limited

Thomas B Merala

Jay DeAvis Baker

Myron Lemecha

Paul E Stevenson

Bernard A Meyer

Wells L Green

Richard K McMillan, Ii

Kenneth A Salisbury

Matti Mikkor

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.

Micro soldering system for electronic components

Growing community of inventors

Canton, MI, United States of America

Thomas B Merala