Applied Materials, Inc.

Velo3d, Inc.

Butterfly Health, Inc.

Applied Silver, Inc.

Attends Healthcare Products, Inc.

Other

Lucira Health, Inc.

Pfizer Corporation

Solyndra, LLC

Vel03d, Inc.

Thomas B Brezoczky

Kirankumar Neelasandra Savandaiah

Srinivasa Rao Yedla

Bhaskar Prasad

Hung Chih Chen

Kelly Lewis Brezoczky

Nitin Bharadwaj Satyavolu

Jeonghoon Oh

Benyamin Buller

Steven M Zuniga

Alan Rick Lappen

Karl Ronn

Steven B Gold

Tsz-Sin Siu

Elizabeth Hodge Ronn

Zachary R Murphree

Sean Morham

David E Brown

William Morris

Keith Copenhagen

Richard Joseph Romano

Andrew J Nagengast

Erel Milshtein

Anubhav Srivastava

Daniel Christiansen

Debkishore Mitra

Frank B Myers, Iii

Roger V Heyder

Lakshmikanth Krishnamurthy Shirahatti

Anantha K Subramani

Cheng-Hsiung Matt Tsai

Douglas R McAllister

Robert Michael Martinson

David Datong Huo

Clay David Reber

Devi Raghavee Veerappan

Ganesh Subbuswamy

Deepak Manoharlal

Hari Prasath Rajendran

Kartik Ramaswamy

Srinivas D Nemani

Jennifer Y Sun

Hou Tee Ng

Nag B Patibandla

Philip Allan Kraus

John C Forster

Imran Hashim

Xi Chelsea Chen

Karl M Brown

Simon Yavelberg

Steven Victor Sansoni

Swaminathan T Srinivasan

Bencherki Mebarki

Prashanth Kothnur

Murali K Narasimhan

Chi Hong Ching

Robert E Davenport

Kasiraman Krishnan

John Joseph Mazzocco

Christopher A Rowland

Gene Y Kohara

Yacov Elgar

Farzad Houshmand

Shreesha Y Rao

Gregory Ferguson Brown

Yang Guo

Chris M Gronet

Steven T Mear

Randy D Schmieding

Sheng Michael Guo

Sesh Ramaswami

Alex Brudny

Praburam Gopal Raja

Clay D Reber

Joseph Andrew Tralongo

Anatolii Vitanov

Dean Albert Tarrant

James Frechman

Sreenath Sovenahalli

Kelly Truman

Seh-Kwang Lee

Embodiments described herein relate to methods and apparatus for detecting and/or monitoring, e.g., abnormalities in wafer transfer and handling. In an embodiment, a method for wafer dechucking verification is provided. The method includes initiating a wafer transfer operation to transfer a wafer between components of a semiconductor processing system, the semiconductor processing system comprising a motor coupled to a lift pin, the motor configured to adjust a height of the lift pin above a pedestal, the lift pin for raising or lowering the wafer. The method further includes measuring one or more first parameters during the wafer transfer operation, comparing the one or more first parameters to one or more first pre-determined parameter ranges, and changing a force applied to the lift pin based on the one or more first parameters. Apparatus for wafer dechucking verification and non-transitory computer-readable mediums storing instructions for wafer dechucking verification are also provided

Methods and apparatus for wafer detection

Aspects of the present disclosure relate to systems and apparatuses for a substrate processing assembly with a low processing volume. In disclosed embodiments, a processing volume may include a processing space adjacent to a substrate being processed on a substrate support as well as a volume of the processing chamber surrounding and below the substrate support. In some embodiments, the total processing volume is 15 liters or less in certain embodiments, resulting in lower gas usage and faster processing times than conventional approaches. In some embodiments, the distance between the substrate and a target, electrode, chamber lid, or showerhead face is 35 mm or less in certain embodiments. In certain embodiments, the processing chamber has a dedicated pump for pumping the chamber to a processing pressure as well as evacuating the chamber after processing of the substrate.

Reduced substrate process chamber cavity volume

Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

Substrate processing module and method of moving a workpiece

Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

Apparatus for controlling lift pin movement

The present disclosure provides three-dimensional (3D) printing systems, apparatuses, methods and non-transitory computer readable media for the production of at least one requested 3D object. The 3D printer described herein facilitates operation of a layer dispensing mechanism with high precision albeit operating in an enclosure contaminated by debris, e.g., during the 3D printing. The debris may be a byproduct of the 3D printing.

Three-dimensional printer components

A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

Semiconductor process equipment

A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

Floating pin for substrate transfer

Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

Apparatus, system, and method for non-contact temperature monitoring of substrate supports

Diagnostic device with led display

A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

Isolated volume seals and method of forming an isolated volume within a processing chamber

A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

Cathode exchange mechanism to improve preventative maintenance time for cluster system

Aspects of the present disclosure provide systems and apparatuses for a substrate processing assembly with a laminar flow cavity gas injection for high and low pressure. A dual gas reservoir assembly is provided in a substrate processing chamber, positioned within a lower shield assembly. A first gas reservoir is in fluid communication with a processing volume of the substrate processing assembly via a plurality of gas inlet, positioned circumferentially about the processing volume. A second gas reservoir is positioned circumferentially about the first gas reservoir, coupled therewith via one or more reservoir ports. The second gas reservoir is in fluid communication with a first gas source. A recursive path gas assembly is positioned in an upper shield body adjacent to an electrode to provide one or more gases to a dark space gap.

Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure

Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

Growing community of inventors

San Jose, CA, United States of America

Thomas B Brezoczky