Motorola Corporation

Other

Thomas Andrew Roche

Ronald Dee Fuller

Robert E Edminster

Allen E Christ

Wade Norman Understiller

Anthony Neil Davino

Vinton John Lewis

A method (,) for coating a substrate including at least an elastomer substrate portion with a conductive coating is described. The method includes steps of (i) providing a substrate comprising elastomer material and (ii) coating (,) the substrate with an adhesion promoting layer. The layer comprises a thin layer of B stage heat curable epoxy. The method also includes steps of (iii) pre-curing (,) the adhesion-promoting layer, (iv) disposing (,) a conductive coating atop the layer and (v) post-curing (,) the adhesion-promoting layer.

Metalized elastomers

A method (60) for molding (67) a component (73) including a free floating insert (11). The method includes steps of providing an insert (11) including one or more weakened regions (23) coupled to a removable leader (20) and molding (67) a moldable compound (25) about the insert (11) and a portion of the removable leader (20). The method (60) further includes a step of pulling (69) on the removable leader (20) to fracture the weakened regions (23) and thereby detach the removable leader (20) from a molded component (73) including the insert (11) therein. The molding step (67) desirably includes a step of injection molding (67) a thermoplastic material (25) about the insert (11) and the portion of the removable leader (20).

Method of molding free-floating insert

An apparatus which routes electrical conductors through a sealed opening in a wall using a flexible printed wiring cable is disclosed. The apparatus includes a thermoplastic material injection molded around a flexible printed wiring cable. Within the molded object, the cable contains two sections where cable conductors are not enclosed within flexible printed wiring insulation. The two sections are separated by a third section in which cable conductors are enclosed within insulation. The cable additionally contains an increased amount of conductor material where the cable enters and exits the molded object. Two O-rings are contained within the periphery of the molded object.

Sealed flexible printed wiring feedthrough apparatus

An integrated circuit (IC) carrier having uniform conductivity and the ability to securely hold an IC in a predetermined position within the carrier is disclosed. The IC is securely held inside a closed enclosure without using the IC leads to support the IC. Additionally, a viewing window which allows the reading of information printed on the IC from outside the closed enclosure is disclosed. The enclosure is formed as a one-piece object which additionally includes a living hinge, a latching system, structure which aids stacking, and structure which facilitates opening of the enclosure by automated means.

Growing community of inventors

Scottsdale, AZ, United States of America

Thomas Andrew Roche