Honeywell International Inc.

Honeywell G.m.b.h.

Thomas Allan Odegard

Robert D Habing

Larry J Thomas

John Cunningham

Aaron Levine

Bryan P Hansen

Scott Richard Maass

A display interface device and method for an individual personal computer, workstation, or embedded system comprising one or more display interfaces; a video library; and driving any one of a plurality of video displays of a plurality of types connected to the one or more display interfaces from output of the video library. OpenGL is a preferred API. Driving of hybrid displays as well as stroke displays using formats designed for raster displays (such as VAPS) is also provided for. Real-time switching between displays is also provided for.

Multiple and hybrid graphics display types

This invention provides fault tolerant capability for a Versa Module Eurocards backplane system design for high reliability applications. An approach of connecting two independent backplanes together electrically, but providing isolation capabilities in the event of a failure was developed. The electrical connection or integrated bridge design provides a virtual connection between the two VME backplanes that is transparent to the end user. The integrated virtual VMEbus design provides a low latency, high bandwidth interconnect between modules whether located on the same local bus or the electrically isolateable bus. This dual-VME fault tolerant backplane design eliminates complete system failures due to single event failures.

Fault tolerant virtual VMEbus backplane design

A circuit card module having increased cooling efficiency which comprises at least one printed wiring board (PWB), at least one component mounted on the PWB, a heatsink, an interchangeable frame, and a wedgelock for use with a chassis cold wall. One embodiment of the interchangeable frame comprises a protrusion so that it can be used with a convection-cooled chassis (fully compliant with IEEE 1101.2 Specifications). Another embodiment, for use with conduction-cooled chassis only (partially compliant with IEEE 1101.2 Specifications), is maximally efficient in removing heat as it does not include the protrusion. In the embodiment without the protrusion, the conduction contact area between the chassis cold wall and the frame is increased in width from approximately 0.25&Prime; to approximately 0.35&Prime;. In either embodiment, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. In addition, the wedgelock can be enlarged to increase the clamping force over the contact area. The increased wedgelock size approximately doubles the clamping force applied. The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length. This, in turn, reduces the module to chassis interface temperature rise of an exemplary 40 W module from 8.3&deg; C. to 4.15&deg; C. The improved thermal resistances and decreased temperature rises boost the reliability of the circuit cards, particularly in the stringent environments experienced in military applications.

Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module

An adapter for commercial off-the-shelf (COTS) circuit card modules resulting in increased cooling efficiency. COTS circuit card modules generally have at least one printed wiring board (PWB), at least one component mounted on the PWB, a heatsink or some type of heat path, a frame for supporting the cards, and a wedgelock for use with a conduction-cooled chassis. The adapter increases the cooling efficiency of such COTS modules while allowing them to remain compliant with IEEE 1101.2 Specifications. The invention is efficient in removing heat from the COTS circuit card modules as it increases the conduction contact area between the chassis cold wall and the COTS module. In addition, the adapter allows for the use of an extended width wedgelock to increase the clamping force over the conduction contact area. The extended width wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. The increased wedgelock size approximately doubles the clamping force applied. The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length. This, in turn, reduces the module to chassis interface temperature rise. The improved thermal resistances and decreased temperature rises boost the reliability of the COTS circuit cards, particularly in the stringent environments experienced in military applications.

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Albuquerque, NM, United States of America

Thomas Allan Odegard