Delphi Technologies, Inc.

Borgwarner US Technologies LLC

Thomas Alan Degenkolb

Scott David Brandenburg

Suresh K Chengalva

Bruce Alan Myers

Darrel Eugene Peugh

Morgan Daniel Murphy

Ronald Melvin Taylor

Yew Kwang Low

Kok Wee Yeo

Matthew R Walsh

Larry M Mandel

David A Laudick

Ward K Everly

Todd P Oman

Shing Yeh

Ralph S Taylor

Henry M Sanftleben

Richard Dixon Parker

Ching Meng Fang

Gary Eugene Oberlin

Jeenhuei S Tsai

Alexandre M S Reis

Sim Ying Yong

Michael Jeffrey Lowry

Kin Yean Chow

Eric A Brauer

Daniel Leong Woon Loong

Loren H Rasmussen

Victor C M Wong

Scott D Brandenbrug

A power semiconductor package includes: a first power semiconductor; a cold plate including a floor and a first pedestal extending from the floor, wherein the first pedestal is configured to support the first power semiconductor; a thermal interface material configured to transfer heat from the first power semiconductor to the first pedestal of the cold plate; and a spacer including: a first frame configured to receive at least a portion of the first pedestal, and a second frame configured to receive the thermal interface material; wherein the spacer is configured to provide a uniform thickness of the thermal interface material between the first pedestal of the cold plate and the first power semiconductor.

Systems and methods for a top side cooled power semiconductor thermal interface spacer

A multiple imager camera includes a block, an imager, and an alignment apparatus. The block is configured to direct an image to a plurality of imagers located proximate to a plurality of apertures defined by the block. The imager of the plurality of imagers is configured to receive the image through an aperture of the plurality of apertures. The alignment apparatus is interposed between the block and the imager. The alignment apparatus is configured to allow for six degrees of freedom to align the imager with the image. The six degrees of freedom include adjustment along a x-axis, a y-axis, and a z-axis of the aperture, and adjustment about a pitch-axis, a yaw-axis, and a roll-axis of the aperture. The alignment apparatus is further configured to fixedly couple the imager to the block after the imager is aligned with the image.

Multiple imager camera

An optical sensor system adapted to operate through a window of a vehicle includes a lens, a plurality of optoelectronic devices, and an optical device. The lens is configured to direct light from a field-of-view toward a focal plane. The plurality of optoelectronic devices are arranged proximate to the focal plane. The plurality of optoelectronic devices includes a first optoelectronic device operable to detect an image from a first portion of the field-of-view, and a second optoelectronic device operable to detect light from a second portion of the field-of-view distinct from the first portion. The optical device is configured to direct light from outside the field-of-view toward the second portion.

Vehicle optical sensor system

An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

Fluid cooled encapsulated microelectronic package

A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.

Leaded semiconductor power module with direct bonding and double sided cooling

An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having first electrical circuitry formed on a surface, an elastomer, and second electrical circuitry disposed at least partially between the substrate and the elastomer. Elements of the second electrical circuitry are pressed into contact with contact pads of the first electrical circuitry. The electrical connector assembly also includes a holder securing the elastomer in a compressed state to provide a pressure contact between the circuit elements and the contact pads.

Solderless electrical interconnection for electronic package

An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.

Wrap-around overmold for electronic assembly

An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having electrical circuitry, a shroud, and a plurality of conductive pins. The conductive pins are pressed into contact with contact pads of the electrical circuitry. The electrical connector assembly also includes an overmolding material securing the shroud such that the conductive pins contact the electrical circuitry.

Electrical pin interconnection for electronic package

An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.

Compression connection for vertical IC packages

A surface mount connector and assembly including the surface mount connector is shown and described. The assembly comprises a substrate and a connector including a carrier, and at least one electrical connecting element having first and second ends, wherein at least a portion of the first end extends through the carrier to electrically adjoin and physically secure the connector to the substrate. A reinforcement medium is disposed about at least a portion of surface mount connector and said substrate.

Surface mount connector

A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by heat producing components of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels are formed by insert-molding a form in the encapsulant, and removing the form following the molding process. Alternately, the encapsulant is formed in two or more pieces that are joined to form the package, and the coolant channels are defined by recesses formed in at least one of the encapsulant pieces.

Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels

An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.

Electronics assembly and electronics package carrier therefor

A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.

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Noblesville, IN, United States of America

Thomas Alan Degenkolb