Other

Microelectronics and Computer Technology Corporation

Thomas Alan Bishop

Daniel M Andrews

Ernest R Nolan

Michael A Olla

Kenneth C Noddings

Richard D Nelson

David H Carey

Michael J Bertram

Robert W Froehlich

Chung J Lee

Randy L German

Mark R Breen

Diana C Duane

Kimcuc T Tran

Kathryn V Keswick

Todd H Herder

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

Fabrication of optical devices and assemblies

TAB tape is used to contact integrated circuit chip electrodes (without actual metallurgical bonding) at approximately 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site can be transported, tested, and burned-in like a TAB chip on tape. A TAB tape frame is utilized with the inner lead bond fingers angled upwards so that the ends of the fingers perform a scrubbing action on the chip contacts when the IC chip is engaged with the TAB tape slide carrier socket. A silicone bead provides a spring-like action underneath the fingers.

Tab tape-based bare chip test and burn-in carrier

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Compliant electrically connective bumps for an adhesive flip chip

Removing welded outer lead bonds of TAB tape leads to contacts on a substrate. The method includes separating the electrical leads adjacent the weld bonds leaving a remnant, engaging the remnant with a shear tool, and moving the tool and bond relative to each other shearing the remnant. In some cases the tool is ultrasonically vibrated in a direction transversely to the relative movement of the tool and bond.

Method and apparatus for removing bonded connections

A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.

Method and apparatus for using desoldering material

Growing community of inventors

Austin, TX, United States of America

Thomas Alan Bishop