Symbotic LLC

Brooks Automation Gmbh

Varian Semiconductor Equipment Associates, Inc.

Confluent Photonics Corporation

Thomas A Schaefer

Forrest Buzan

Russell G Barbour

Edward A MacDonald

Taylor A Apgar

Melanie Ziegler

Peter Van Der Meulen

Patrick D Pannese

Todd E Kepple

Christopher C Kiley

Raymond S Ritter

Kevin J McIntyre

Brian James McKeen

Gregory G Cappiello

William Johnson

Rick K Dorval

John F Keating

Andrew J Radl

William John Hubbard

Ninghui Zhu

Gordon Angel

Edward D MacIntosh

Rajen Sud

Edward Macdonald

Predrag Puskarevic

John Matthews

Dick Rolfe

Michael Fiorito

Kurt E Abdelmaseh

Evgueni V Babenko

Paul Ouellette

Ian C Prees

Mélanie Ziegler

Thomas Perry

Lawrence Margagliano

An automated storage and retrieval system including at least one autonomous rover for transferring payload within the system and including a communicator, a multilevel storage structure, each level allowing traversal of the at least one autonomous rover, at least one registration station disposed at predetermined locations on each level and being configured to communicate with the communicator to at least receive rover identification information, and a controller in communication with the at least one registration station and configured to receive the at least rover identification information and at least one of register the at least one autonomous rover as being on a level corresponding to a respective one of the at least one registration station or deregister the at least one autonomous rover from the system, where the controller effects induction of the at least one autonomous rover into a predetermined rover space on the level.

Storage and retrieval system rover interface

Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Semiconductor wafer handling transport

Semiconductor wafer handling and transport

Methods and apparatus are provided for measuring a profile of an ion beam. The apparatus includes an array of beam current sensors, each producing a sensor signal in response to incident ions of the ion beam, a translation mechanism configured to translate the array of beam current sensors along a translation path with respect to the ion beam, and a controller configured to acquire the sensor signals produced by the beam current sensors at a plurality of positions along the translation path, wherein the acquired sensor signals are representative of a two-dimensional profile of the ion beam.

Apparatus and methods for two-dimensional ion beam profiling

An ion implanter has an elongated evacuated chamber having a distal end along the path of travel of an ion beam. A planar multilayer printed circuit board (PCB) is located at the distal end of the chamber. The PCB has a first portion sealingly covering the distal end of the chamber and a second portion that extends outside the evacuated chamber, for example in the upward direction. An array of Faraday cups are arranged on a proximal surface of the first portion of the PCB within the chamber, and one or more multi-contact connectors (such as D-type connectors) are located on the second portion of the PCB outside the chamber. The individual contacts of the connector(s) are connected to respective Faraday cups by circuit traces of the PCB.

Ion implanter with vacuum-maintaining circuit board providing connections to internal faraday cups

An opto-mechanical platform for supporting truncated optical elements having at least one substantially flat side surface is disclosed. In one particular exemplary embodiment, the opto-mechanical platform may be realized as an apparatus for supporting truncated optical elements having at least one substantially flat side surface. Such an apparatus may comprise a platform having a substantially flat surface area for supporting the substantially flat side surface of the truncated optical elements. Such an apparatus may also comprise at least one substantially vertical wall formed on at least a portion of the platform for providing mechanical rigidity to the platform.

Opto-mechanical platform

A technique for attaching an optical element to a structural element is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for attaching an optical element to a structural element. Such an apparatus may comprise an optical element formed of a material having a first coefficient of thermal expansion value, a structural element formed of a material having a second coefficient of thermal expansion value, and an intermediate element formed of a material having a third coefficient of thermal expansion value that is between the first coefficient of thermal expansion value and the second coefficient of thermal expansion value. The intermediate element is disposed between the optical element and the structural element such that thermal stress between the optical element and the structural element are transferred to the intermediate element.

Optical element mounting technique

Growing community of inventors

Groveland, MA, United States of America

Thomas A Schaefer