International Business Machines Corporation

Thomas A Kline

Govindarajan Natarajan

Mark J LaPlante

Hsichang Liu

Renee L Weisman

Jay A Bunt

Donald W Diangelo

Thomas Foley

Melvin R Gottschalk, Jr

Lisa A Hamilton

Sebastian Loscerbo

Olga A Otieno

Cristian Docu

John Anthony Fitzsimmons

John P Gauci

Patrick F White

Embodiments of the present invention relate to detecting leaks in a fluid cooling system. One aspect of the present invention concerns an apparatus for detecting leaks in a fluid cooling system that includes a pressure exerting device for applying a pressure on a supply hose and a return hose of the cooling system, and a pressure gauge coupled to the pressure exerting device for detecting a drop of fluid pressure in the cooling system while the pressure is applied. The drop of fluid pressure indicates that there may be a leak in the cooling system.

Detecting leaks in a fluid cooling system by sensing for a drop of fluid pressure in the system

An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

A multilayer ceramic substrate with an internal cavity extending from the top to the bottom surface of the substrate is produced using an insert material which fits within a cavity defined by aligned openings of individual ceramic sheets in a multilayer stack. The multilayer stack of ceramic sheets, together with the insert, is press-molded together with the insert serving as an internal mold that maintains the internal dimensions of the cavity. The insert is slightly larger in its top to bottom dimension than the multilayer stack and is driven into a compressible material underlying the multilayer stack during the pressing operation. The insert prevents the ceramic from flowing upwards into the center of the cavity during the pressing operation. In addition, the insert embeds electrically conductive pads located at various levels inside the cavity on individual ceramic sheets in the multilayer stack into the top surfaces of the ceramic sheets. After molding, the insert and the compressible material are removed from the multilayer structure. The invention has a particular application for forming multilayer ceramic structures that are connected to an integrated circuit chip and heat sink combination that will be positioned inside the cavity of the ceramic structure.

Process for forming open-centered multilayer ceramic substrates

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Wappingers Falls, NY, United States of America

Thomas A Kline