Raytheon Company

Thomas A Hanft

Michael A Moore

Kenneth William Brown

John Michael Bedinger

Andrew Kent Brown

Sankerlingam Rajendran

Darin M Gritters

Patrick J Kocurek

Douglas R Gentry

Susan M Eshelman

Monte R Sanchez

A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.

Dispensable polyimide aerogel prepolymer, method of making the same, method of using the same, and substrate comprising patterned polyimide aerogel

An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.

Electronic device including hermetic micro-cavity and methods of preparing the same

Integrating a semiconductor component with a substrate through a low loss interconnection formed through adaptive patterning includes forming a cavity in the substrate, placing the semiconductor component therein, filling a gap between the semiconductor component and substrate with a fill of same or similar dielectric constant as that of the substrate and adaptively patterning a low loss interconnection on the fill and extending between the contacts of the semiconductor component and the electrical traces on the substrate. The contacts and leads are located and adjoined using an adaptive patterning technique that places and forms a low loss radio frequency transmission line that compensates for any misalignment between the semiconductor component contacts and the substrate leads.

Heterogeneous chip integration with low loss interconnection through adaptive patterning

Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.

High frequency, high bandwidth, low loss microstrip to waveguide transition

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Allen, TX, United States of America

Thomas A Hanft