Intel Corporation

Thomas A Boyd

Russell S Aoki

Eric W Buddrius

Jeffory L Smalley

Feifei Cheng

Shelby A Ferguson

Rolf Laido

Ralph V Miele

Steven A Klein

Bijoyraj Sahu

Mustafa H Haswarey

Harvey R Kofstad

Daniel Neumann

Donald Tiendung Tran

Kuang C Liu

Anthony P Valpiani

Mohanraj Prabhugoud

Michael Zack Eckblad

Craig J Jahne

Kevin Ceurter

Karumbu Meyyappan

Evan A Chenelly

Divya Swamy Bandaru

Debendra Mallik

Mathew J Manusharow

Sriram Srinivasan

Srikant Nekkanty

Dimitrios Ziakas

Daniel P Carter

David J Llapitan

Gregorio R Murtagian

Andrew Larson

Eric Dwight McAfee

Jonathan W Thibado

Christopher Wade Ackerman

Minh T Le

Feroz Mohammad

Michael S Brazel

Michael Hui

Sridhar Narasimhan

Paul H Anderson

Jonathon Robert Carstens

Hongfei Yan

Henry C Bosak

Carlos Alvizo Flores

Ming-Chen Chang

Rashelle Yee

Joseph J Jasniewski

Jorge Contreras Perez

Yong Wang

Luis Gil Rangel

Muffadal Mukadem

Francis Toth, Jr

Ricky R Feightner

A James Geddes

Rachel Taylor

Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation

Compression mounted technology (CMT) socket retention mechanisms to board or interposer

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Socket load regulation utilizing CPU carriers with shim components

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Method and apparatus for detaching a microprocessor from a heat sink

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Connector for processor package

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

Electronic device, socket, and spacer to alter socket profile

Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a substrate, a first die, a gasket, and a thermal interface. The first die may be connected to the substrate. The gasket may be connected to the substrate and may encircle the first die to form a space between the first die and the gasket. The thermal interface material may be located within the space formed by the first die and the gasket.

Mechanical seal and reservoir for microelectronic packages

A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

Rework grid array interposer with direct power

Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Connector port frame for processor package

In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.

Method for installing integrated circuit devices on a substrate

Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed.

Semiconductor package alignment frame for local reflow

An example apparatus for connecting linear edge cards includes a housing to hold at least one set of conductive contacts facing perpendicularly towards a mating plane. The apparatus further includes an activator bar coupled to the housing, the activator bar to hold two parts of the housing apart via two opposing normal forces. The apparatus also includes a contact load spring coupled to the housing, the contact load spring to apply two forces parallel to the direction of the conductive contacts and against the two opposing normal forces of the activator bar. The apparatus further includes an ejector spring coupled to the contact load spring and the activator bar. The ejector spring is to apply a force perpendicular to the two opposing normal forces of the activator bar and in a direction of an opening of the housing.

Linear edge connector with activator bar and contact load spring

Growing community of inventors

North Plains, OR, United States of America

Thomas A Boyd