Infineon Technologies Ag

Thilo Stache

Michael Melzl

Josef Schwaiger

Stephan Bradl

Werner Kröninger

Stephen Bradl

Walther Grommes

The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Treatment of a substrate with a liquid medium

A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Method for machining a workpiece on a workpiece support

Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium

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Wuppertal, Germany

Thilo Stache