Tdk-micronas Gmbh

Micronas Gmbh

Thilo Rubehn

Marc Baumann

Christian Joos

Jochen Stephan

Joerg Franke

Wolfgang Horn

Joachim Ritter

Manfred F Ullrich

Reiner Bidenbach

Manfred Ullrich

Hans-Jörg Fink

Martin Bayer

Jörg Franke

Dieter Baecher

Gert Umbach

Eckart Wagner

Dieter Bächer

A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

Sensor component with cap over trench and sensor elements

A method for increasing a reliability of transducers having a first IC and a second IC, each has a sensor and a signal output and a signal input and a comparator, and a sensor signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the respective signal outputs. The signal outputs are each connected to a first input of the comparator, and the signal inputs are each connected to a second input of the comparator. The two ICs can be integrated into a common IC package, and the signal output of the first IC is connected to the first input of the comparator on the first IC and to the signal input of the second IC and to a first contact area passing through the IC package.

Method for increasing the reliability of transducers

A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

Component with reduced stress forces in the substrate

A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

Circuit package

Method for a deterministic selection of a sensor from a plurality of sensors, having a control unit and multiple sensors connected to the control unit by means of a three-wire bus, wherein the sensors are connected parallel to one another at a three-wire bus by at least two lines and a protocol frame according to SENT specification is used between the control unit and the sensors for a data exchange, and within the protocol frame a specified sensor is selected from a plurality of sensors by means of a selection signal sent by the control unit, wherein each sensor is associated with an unambiguous number of pulses for the selection of the sensor, and the selection of the sensor is performed by means of the selection signal having a predetermined number of pulses occurring immediately in succession.

Method for a deterministic selection of a sensor from a plurality of sensors

The invention relates to an integrated circuit arrangement with connection contacts for the serial exchange of data and/or signals with external components and apparatuses and with a control apparatus and/or a serial interface for the clocked receiving of data by means of a signal voltage on such a connection contact, which voltage is modulated between at least one low, one middle and one high voltage state. The control apparatus and/or the interface are designed in such a manner that data is sent in a sending mode via the connection contact in that the switching apparatus, after having received a slope changing in particular from the middle voltage state into in particular the higher or the lower voltage state, pulls the voltage state into the in particular opposite lower or higher voltage state. Furthermore, the invention relates to an apparatus and a process for operating such a circuit arrangement.

Circuit arrangement, apparatus and process for the serial sending of data via a connection contact

A method and circuitry for checking the programming (P) and deletion (L) operations of memory cells () in a nonvolatile memory device (). Parallel to the programming (P) or deletion (L) operations of the actual memory cells () the respective programming or deletion process is carried out on at least one similar checking cell (), with the programming (P) or deletion (L) operations being less favorable by a defined extent than the programming (P) or deletion (L) operations of the actual memory cells (). From the content of the checking cell () an evaluation device () determines whether the programming (P) or deletion (L) operation was successful or not, and a corresponding output signal (ak) indicative thereof is produced.

Growing community of inventors

Gundelfingen, Germany

Thilo Rubehn