Université Paul Sabatier (Toulouse III)

Centre National De La Recherche Scientifique

Alstom

Université De Picardie Jules Verne

Thierry Lebey

Pierre-Louis Taberna

Patrice Simon

Fabrice Breit

Jean-Marie Tarascon

Emmanuel Dutarde

Jose Saiz

Quang Trong Nguyen

Jos&eacute; Saiz

Sophie Guillemet

Sorin Dinculescu

Bernard Durand

Madona Boulos

Jean Marie Tarascon

Quoc Hung Luan

Vincent Bley

Jean Pascal Cambronne

Jean-Pascal Cambronne

Quang Nguyen

The invention relates to a self-supporting composite element and to a method of producing same. The composite element comprises a substrate of electronic conductive material which is covered with metal nanowires that are essentially oriented along a plane that is perpendicular to the substrate. The element is produced in a cell comprising a cathode which is formed by the substrate to be covered, one or more anodes and an electrolyte which is formed by a solution of a precursor of the metal material and optionally containing a conductive ionic salt, a flat porous membrane which is placed between the cathode and each of the anodes and a spacer element between each membrane and the anode adjacent thereto, the different constituent parts of the cell being maintained in contact.

Method for the electrolytic production of self-supporting conductive nanocomposite elements

A method of fabricating an electrically conductive mechanical interconnection element () comprises: a first stage of electrochemically depositing a structure comprising a plurality of metal wires () of sub-micrometric diameter projecting from the likewise metallic surface of a substrate (); and a second stage of controlled partial dissolution of said wires to reduce their diameter. A method of making a mechanical and/or electrical interconnection, the method comprising the steps consisting in: fabricating two interconnection elements by a method as described above; and placing said interconnection elements face to face and pressing one against the other so as to cause the nanometric wires projecting from the surfaces of said elements to interpenetrate and tangle together. A three-dimensional electronic device comprising a stack of microelectronic chips mechanically and electrically connected to one another by such interconnection elements.

Method for making an electrically conducting mechanical interconnection member

The present invention relates to a method of preparing ceramics based on lanthanum-doped barium titanate, which comprises the following steps: (a) flash sintering of lanthanum-doped barium titanate powders; and (b) heat treatment of the material thus obtained, in an air atmosphere or in an oxidising atmosphere. The invention also relates to ceramics based on lanthanum-doped barium titanate, possessing a very high real part of the relative dielectric permittivity, and to their use for obtaining capacitors of high capacitance and high capacitance per unit volume for high-voltage withstand capability.

Ceramics based on lanthanum-doped barium titanate, method of preparation and uses

This power switching cell comprises: Each intermediate bond () as well as the faces of the components linked to this intermediate bond are entirely incorporated inside said substrate, and the faces not linked to an intermediate bond () of the components situated at the ends of said chain () are disposed in such a way as to be separated from one another by way of the dielectric material forming said substrate (). This substrate is formed of a stack of parallel sheets () of dielectric material, and each of the components () following in said chain is incorporated in the thickness of a different sheet.

Module for high voltage power for converting a base of IGBT components

A method of testing a power module including a control gate, an emitter, a collector, at least one power component on a dielectric substrate and a diode connected in antiparallel with the power component measures partial discharges occurring between the emitter and the collector when an alternating current voltage source superimposed on a direct current voltage source is connected between the collector and the emitter of the power module. The voltage V received by the power module between the collector and the emitter verifies at all times the condition V >0 so that the diode never conducts. The power component is maintained in a turned off state during the test by a direct current voltage source connected between the control gate and the emitter.

Method and a device for testing a power module

Growing community of inventors

Lacroix Falgarde, France

Thierry Lebey