Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique Et Aux Energies

Thibaut Sohier

Stephan Borel

Jean-Philippe Michel

Gilles Simon

Stéphan Borel

A method is provided for detecting an attack by electromagnetic waves on an electronic chip or system-in-package type device including an attack detection element comprising a GMI-effect electrically-conductive material. The method includes demagnetising the GMI-effect material such that the value of its remanent magnetisation is equal to a predefined value lower than the value of its maximum remanent magnetisation. The method further includes determining a first value of the impedance of the attack detection element, and then after a time period during which the device might have undergone an attack, measuring a second value of the impedance of the attack detection element by circulating in the GMI-effect electrically-conductive material an alternating current with the same frequency as when determining the first impedance value. The method also includes comparing the first and second values of the impedance of the attack detection element.

Method for detecting an attack by electromagnetic waves of a chip or a system-in-package based on the GMI effect

Device of the chip or electronic system-in-package type, comprising at least one element for protecting at least part of at least one face of the device, said protective element comprising at least:

Chip or system-in-package protection using the GMI effect

An electronic system in package, including at least: a support; one or more chips mechanically and electrically coupled to a front face of the support; an encapsulation material covering the front face of the support and encapsulating the chip(s); several side protection elements, comprising an opaque material and laterally surrounding the chip(s) and configured to form a barrier at least against laser attacks made through side faces of the electronic system in package that are substantially perpendicular to the front face of the support; and wherein the side protection elements are disposed in the encapsulation material or in one or more first blocks of material distinct from the support and disposed in the encapsulation material.

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Grenoble, France

Thibaut Sohier