Synthomer Sdn. Bhd

Thian Hong Ng

Zhenli Wei

Gareth Simpson

Alexandra Abele

Claudia Eigen

Asrulrani Abd Rani

Floyd Greaves

Dieter Wolters

A curable polymer latex composition obtainable by:

Curable polymer latex compositions for the manufacture of rubber articles

The present invention relates to a polymer latex for dip-molding applications including: particles of a carboxylated conjugated diene nitrile latex polymer in combination or association with particles of a latex polymer including at least one oxirane-functional group, to the use of said polymer latex for the production of dip-molded articles or for coating or impregnating a substrate, to compounded compositions including said polymer latex, to a method for making dip-molded articles and to articles made by using said polymer latex.

Polymer latex for dip-molding applications

A polymer latex composition for dip-molding applications includes the reaction product obtained by free-radical emulsion polymerization in aqueous medium of ethylenically unsaturated monomers including; (a) 19.9 to 90 wt.-% of at least one aliphatic conjugated diene; (b) 9.9 to 80 wt.-% of at least one unsaturated nitrile; (c) 0.1 to 10 wt.-% of at least one ethylenically unsaturated acid; (d) 0 to 19 wt.-% of at least one aromatic vinyl compound, and (e) 0 to 20 wt.-% of at least one further ethylenically unsaturated compound different from any of compounds (a) to (d), the weight percentages being based on the total amount of monomers, wherein the emulsion polymerization is conducted in presence of a degraded polysaccharide having a DE of 2 to 90 measured according to ISO 5377 (Dec. 15, 1981) to a method for making said polymer latex composition, to a curable polymer latex compound including said polymer latex composition, to a method for making dip molded latex films employing said curable polymer latex compound, to a film made from said polymer latex composition and to articles including said film or being coated with said polymer latex composition.

Polymer latex composition for dip-molding applications

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Parit Raja, Malaysia

Thian Hong Ng